Abstract: A mask assembly device includes a front mask mount and a rear mask mount, where each of the front mask mount and the rear mask mount includes a mask mount stand, and a bridge mount including a bridge mount stand. The bridge mount stand includes a bridge mount stand top positioned between the front mask mount and the rear mask mount, and a bridge mount stand magnet which provides a magnetic flux to the bridge mount stand top.

Abstract: An acoustic measuring apparatus installed in a vacuum chamber to determine a state of a sound wave generation source in the vacuum chamber is provided. The acoustic measuring apparatus includes: a sound wave collecting apparatus in a vacuum chamber and configured to collect sound generated from a sound wave generation source in the vacuum chamber; and a feed-through configured to convert sound wave information of sound collected by the sound wave collecting apparatus into an electrical signal and to transmit the sound wave information outside the vacuum chamber.

Abstract: A deposition apparatus includes an electrostatic chuck which supports a substrate, a mask assembly disposed on a surface of the substrate, a deposition module disposed to be movable in a horizontal direction intersecting a thickness direction of the mask assembly, where the deposition module discharges a deposition material to the mask assembly, and a camera which captures an image of the electrostatic chuck or the mask assembly, where the deposition module is in a deposition position overlapping the mask assembly in the thickness direction of the mask assembly while the deposition module discharges the deposition material, and is in a standby position not overlapping the mask assembly in the thickness direction of the mask assembly while the deposition module does not discharge the deposition material, and the camera captures the image of the electrostatic chuck or the mask assembly when the deposition module is in the standby position.

Abstract: A particle removal apparatus includes a main body portion through which a laser for machining a workpiece passes and a particle generated from machining the workpiece is suctioned, and a particle collector connected to the main body portion. The main body portion includes a particle inlet through which the particle removal apparatus is configured to suction, a laser inlet through which the laser passes, a particle outlet through which the particle removal apparatus is configured to discharge the particle suctioned into the main body portion, a first flow path connecting the particle inlet and the laser inlet, and a second flow path connecting the first flow path and the particle outlet. The particle collector is connected to the particle outlet and is configured to apply a first suction pressure and a second suction pressure. The first flow path includes a pressure reducing section.

Abstract: An evaporation apparatus includes a lower case that accommodates a deposition material, a nozzle emitting the deposition material, a first angle limiting member including a first angle limiting plate extending in a direction that limits an angle of the deposition material emitted from the nozzle, a plurality of first cooling fins connected to a side of the first angle limiting member, and a first heat exchanger having a plurality of first heat exchange fins located between the plurality of first cooling fins.

Abstract: Apparatus for a deposition system includes a sealing apparatus that seals the drive shaft from the deposition material to prevent the deposition material from adhering to the drive shaft, a moving apparatus to reduce the weight of a shelf on the drive shaft, and a collision-preventing apparatus that measures the distance between a shelf and an adjacent article.

Abstract: Disclosed is a method of forming a pattern on a mask sheet including an attaching portion to be attached to a mask frame, and a pattern area in which the pattern is formed. The method includes positioning the mask sheet on an auxiliary sheet with a thickness greater than the thickness of the mask sheet, fastening the auxiliary sheet to the mask frame, applying a stretching force to the mask sheet and the auxiliary sheet, and forming the pattern on the pattern area of the mask sheet. Thus, a predetermined pattern is formed on a mask sheet while a uniformly distributed external force is applied to the mask sheet, so that bending or deflecting out of plane by the mask sheet is prevented, thereby forming a precise mask pattern.

Abstract: An apparatus for aligning a tray and tray holder, including a vertically positioned tray formed with coupling holes and a tray holder having coupling arms to couple with the coupling holes, and to prevent the bending of the tray and the tray holder. The tray includes a substrate frame that can receive a substrate, and the tray holder is coupled with a drive shaft for transferring the tray in the vertical position to a mask for vapor deposition. One end of a plurality of guide shafts securely contacts the rear side of the tray holder to prevent bending of the tray holder. The tray can have magnetic attaching members and the tray holder can have supporting members corresponding to the attaching members. The supporting members can magnetically couple with the attaching members in a position determined by corresponding grooves or protrusions to align the tray and tray holder.

Abstract: A device for aligning a substrate and a mask, and a method using the same, where the device includes aligning marks in unused portions of the substrate and the mask, a sensing unit for determining overlap of the aligning marks when the substrate is aligned with the mask, and a control unit for controlling an aligning process to be repeated on the basis of data sensed and determined by the sensing unit. The sensing unit may include a camera positioned in photographic range to determine any alignment error in the alignment marks. According to another embodiment of the present invention, the alignment error between the substrate and the mask is sensed to determine whether it is acceptable or not. When the alignment error is unacceptable, the operations for aligning the substrate with the mask are repeated until the alignment error is acceptable.