Patents by Inventor Eugene Lemoine

Eugene Lemoine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for multi-chip module die extraction and replacement
    Patent number: 8338230
    Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: December 25, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Thomas E. Love, Eugene Lemoine, David H. Lee, Christopher Ebel
  • SYSTEM AND METHOD FOR MULTI-CHIP MODULE DIE EXTRACTION AND REPLACEMENT
    Publication number: 20120015480
    Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
    Type: Application
    Filed: September 27, 2011
    Publication date: January 19, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Thomas E. Love, Eugene Lemoine, Christopher Ebel, David Lee
  • System and method for multi-chip module die extraction and replacement
    Patent number: 8067829
    Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: November 29, 2011
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Thomas E. Love, Eugene Lemoine, David H. Lee, Christopher Ebel
  • SYSTEM AND METHOD FOR MULTI-CHIP MODULE DIE EXTRACTION AND REPLACEMENT
    Publication number: 20100276794
    Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
    Type: Application
    Filed: April 29, 2009
    Publication date: November 4, 2010
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Thomas E. Love, Eugene Lemoine, Christopher Ebel, David H. Lee