Patents by Inventor Eugene Maria Brinkhof

Eugene Maria Brinkhof has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic clamp, lithographic apparatus, and device manufacturing method
    Patent number: 9360771
    Abstract: An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 7, 2016
    Assignee: ASML Netherlands B.V.
    Inventors: Eugene Maria Brinkhof, Jan Bex, Anko Jozef Cornelus Sijben, Johannes Wilhelmus Damen
  • Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
    Patent number: 9354528
    Abstract: A method of manufacturing a substrate holder for use in a lithographic apparatus, the method including providing a main body having a surface and a plurality of burls projecting from the surface and having end surfaces to support a substrate, providing a carrier surface adjacent the main body surface, and forming a conductive layer on at least part of the main body surface and an integral part on at least part of the carrier surface.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: May 31, 2016
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Jan Bex, Nicolaas Ten Kate, Raymond Wilhelmus Louis Lafarre, Johannes Wilhelmus Damen, Eugene Maria Brinkhof, Yogesh Pramod Karade
  • Electrostatic Clamp, Lithographic Apparatus, and Device Manufacturing Method
    Publication number: 20140218711
    Abstract: An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 7, 2014
    Applicant: ASML Netherlands B.V.
    Inventors: Eugene Maria Brinkhof, Jan Bex, Anko Jozef Cornelus Sijben, Johannes Wihelmus Damen
  • Heat transfer assembly, lithographic apparatus and manufacturing method
    Patent number: 8502960
    Abstract: A lithographic apparatus includes a heat transfer assembly configured to temperature control at least a portion of the lithographic apparatus. The heat transfer assembly includes a printed circuit board, and a plurality of heat transfer elements. The printed circuit board and the plurality of heat transfer elements are configured to be attached to the portion of the lithographic apparatus. The plurality of heat transfer elements are separate from and are electrically coupled to the printed circuit board.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: August 6, 2013
    Assignee: ASML Netherlands B.V.
    Inventors: Eugene Maria Brinkhof, Joannes Hendricus Maria Van Oers, Robertus Adolphus Maria Kuipers, Vasco Francisco Bovée
  • SUBSTRATE HOLDER, LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND METHOD OF MANUFACTURING A SUBSTRATE HOLDER
    Publication number: 20120274920
    Abstract: A method of manufacturing a substrate holder for use in a lithographic apparatus, the method including providing a main body having a surface and a plurality of burls projecting from the surface and having end surfaces to support a substrate, providing a carrier surface adjacent the main body surface, and forming a conductive layer on at least part of the main body surface and an integral part on at least part of the carrier surface.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 1, 2012
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jan BEX, Nicolaas Ten Kate, Raymond Wilhelmus Louis Lafarre, Johannes Wilhelmus Damen, Eugene Maria Brinkhof, Yogesh Pramod Karade
  • Lithographic Projection Apparatus
    Publication number: 20110134399
    Abstract: A lithographic apparatus arranged to transfer a pattern onto a substrate is disclosed. The lithographic apparatus comprises a power supply and an electrical connector. The electrical connector electrically connects the power supply to another component of the lithographic apparatus. The electrical connector comprises a laminate that comprises, in order, a first conducting layer, a first flexible insulating layer, a conductor configured to carry an electrical current, a second flexible insulating layer and a second conducting layer.
    Type: Application
    Filed: June 11, 2010
    Publication date: June 9, 2011
    Applicant: ASML Netherlands B.V.
    Inventors: Johannes Wilhelmus Damen, Anko Jozef Cornelus Sijben, Johannes Albert Rozenveld, Jeroen-Frank Dekkers, Eugene Maria Brinkhof, Hermannus Antonius Langeler, Petrus Albertus Johannes Francisca Van Gompel
  • Board-to-board connector
    Patent number: 7905729
    Abstract: The invention relates to a board-to board connector (9) comprising at least a first contact module (9a) with a first set of board contacts (20) for connecting to a first board (8), and a second contact module (9B) with a second set of board contacts (21). The connector further comprises an interconnection element (22) for interconnecting at least one of said first set of contacts with at least one of said second set of contacts. The interconnection element enables rerouting and compensation of skew.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: March 15, 2011
    Assignee: FCI
    Inventors: Thierry Clementine Louis Maria Goosens, Bernardus Lambertus Franciscus Paagman, Eugène Maria Brinkhof, Ludwig Gerardus Martinus Antonius Lange
  • HEAT TRANSFER ASSEMBLY, LITHOGRAPHIC APPARATUS AND MANUFACTURING METHOD
    Publication number: 20110007288
    Abstract: A lithographic apparatus includes a heat transfer assembly configured to temperature control at least a portion of the lithographic apparatus. The heat transfer assembly includes a printed circuit board, and a plurality of heat transfer elements. The printed circuit board and the plurality of heat transfer elements are configured to be attached to the portion of the lithographic apparatus. The plurality of heat transfer elements are separate from and are electrically coupled to the printed circuit board.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 13, 2011
    Applicant: ASML Netherlands B.V.
    Inventors: Eugene Maria Brinkhof, Joannes Hendricus Maria Van Oers, Robertus Adolphus Maria Kuipers, Vasco Francisco Bovée
  • Board-To-Board Connector
    Publication number: 20080207011
    Abstract: The invention relates to a board-to board connector (9) comprising at least a first contact module (9a) with a first set of board contacts (20) for connecting to a first board (8), and a second contact module (9B) with a second set of board contacts (21). The connector further comprises an interconnection element (22) for interconnecting at least one of said first set of contacts with at least one of said second set of contacts. The interconnection element enables rerouting and compensation of skew.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 28, 2008
    Applicant: FCI
    Inventors: Thierry Clementine Louis Maria Goosens, Bernardus Lambertus Franciscus Paagman, Eugene Maria Brinkhof, Ludwig Gerardus Martinus Antonius Lange