Abstract: A system and method for securely streaming encrypted digital media content out of a digital container to a user's media player. This streaming occurs after the digital container has been delivered to the user's machine and after the user has been authorized to access the encrypted content. The user's operating system and media player treat the data stream as if it were a being delivered over the Internet (or other network) from a streaming web server. However, no Internet connection is required after the container has been delivered to the user and the data stream suffers no quality loss due to network traffic or web server access problems. In this process of the invention, the encrypted content files are decrypted and fed to the user's media player in real time and are never written to the user's hard drive or storage device. This process makes unauthorized copying of the digital content contained in the digital container virtually impossible.

Abstract: A system and method for securely streaming encrypted digital media content out of a digital container to a user's media player. This streaming occurs after the digital container has been delivered to the user's machine and after the user has been authorized to access the encrypted content. The user's operating system and media player treat the data stream as if it were a being delivered over the Internet (or other network) from a streaming web server. However, no Internet connection is required after the container has been delivered to the user and the data stream suffers no quality loss due to network traffic or web server access problems. In this process of the invention, the encrypted content files are decrypted and fed to the user's media player in real time and are never written to the user's hard drive or storage device. This process makes unauthorized copying of the digital content contained in the digital container virtually impossible.

Abstract: A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture.

Abstract: A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture.

Abstract: A method for making a millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture.

Abstract: A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture.

Abstract: A method for electroless overplating of a conductive metal on printed wiring circuitry components mounted upon a plastic substrate which eliminates deposit metal overgrowth upon the plastic substrate and plastic bonding materials. The substrate and printed wiring are treated by exposure to a tetrafluoromethane plasma environment to chemically passivate, or neutralize, the plastic or adhesive substrate surface areas prior to electroless plating of the printed circuitry elements, thus preventing the establishment of catalyzing ions on the plastic or adhesive surfaces and subsequent lay down of the deposited metal thereon.

Abstract: Carriers forming strips for semiconductor integrated circuit chips. The carrier consists basically of a flexible tape, such as a polyimide. A conductive sheet, such as a copper sheet, is initially prepared to form a lead circuit on one surface and a bump circuit on the other. This metal sheet may be gold plated. Subsequently, a layer of polyimide is applied to the lead circuit side and both the polyimide sheet and the opposite bump circuit are covered with a metal sheet, such as copper. A photoresist layer is put over the copper and is suitably illuminated and developed to provide apertures through which the copper can be etched to expose the polyimide sheet. This takes place over the windows or openings adjacent the bumps for the application of a heat ram as well as for the sprocket holes used for precisely aligning the carrier with the to-be-associated semiconductor chips. Finally, openings may also be provided to separate adjacent carrier strips from each other.

Abstract: A method for conditioning drilled holes in multilayer printed wiring boards by removing layers of smeared plastic and adhesive prior to metal plating through the holes for interconnecting conductive layers of the boards includes baking the drilled boards and etching the boards within a plasma reactor chamber, with a predetermined gas pressure, the plasma being created by an RF generator. At the end of a predetermined time period, the RF generator is deactivated and atmospheric air is admitted to the reactor chamber. The reactor chamber is then purged of gases and the printed wiring boards are removed.