Patents by Inventor Eugene R. Hollander

Eugene R. Hollander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for etching the edge of a silicon wafer
    Patent number: 8309464
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: November 13, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • Edge etched silicon wafers
    Patent number: 8192822
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: June 5, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER
    Publication number: 20090242126
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland Vandamme, Guoqiang (David) Zhang
  • EDGE ETCHED SILICON WAFERS
    Publication number: 20090246444
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • METHODS FOR ETCHING THE EDGE OF A SILICON WAFER
    Publication number: 20090247055
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • Apparartus for cleaning semiconductor wafers
    Patent number: 5816274
    Abstract: Apparatus for cleaning semiconductor wafers comprises a tank for containing a liquid wherein the liquid has an upper surface. A wafer holder holds the semiconductor wafer in the tank with at least a portion of the semiconductor wafer being immersed in the liquid within the tank. A wafer-moving mechanism is constructed for engaging the semiconductor wafer in the tank to rotate the semiconductor wafer and to reciprocate the semiconductor wafer so that at least a central region of the wafer repeatedly passes through the surface of the liquid. The wafer-moving mechanism comprises first and second surfaces engageable with the semiconductor wafer and rotatable about respective first and second axes of rotation for rotating the wafer.
    Type: Grant
    Filed: April 10, 1997
    Date of Patent: October 6, 1998
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Ronald D. Bartram, Eugene R. Hollander
  • Apparatus for cleaning semiconductor wafers
    Patent number: 5626159
    Abstract: A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and below the gas-liquid-interface. Sonic energy is directed through the liquid. At least one of the position of the semiconductor wafer and the level of liquid in the bath relative to the semiconductor wafer is varied so that the entire surface of the wafer repeatedly passes through the gas-liquid-interface.
    Type: Grant
    Filed: July 25, 1996
    Date of Patent: May 6, 1997
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Ronald D. Bartram, Eugene R. Hollander, Jing Chai
  • Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
    Patent number: 5593505
    Abstract: A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and below the gas-liquid-interface. Sonic energy is directed through the liquid. At least one of the position of the semiconductor wafer and the level of liquid in the bath relative to the semiconductor wafer is varied so that the entire surface of the wafer repeatedly passes through the gas-liquid-interface.
    Type: Grant
    Filed: April 19, 1995
    Date of Patent: January 14, 1997
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Ronald D. Bartram, Eugene R. Hollander, Jing Chai