Abstract: A method for determining a defect material element, the method includes (a) acquiring, by a charged particle beam system and by applying a spectroscopy process, an electromagnetic emission spectrum of a part of a defect; (b) acquiring, by the charged particle beam system, a backscattered electron (BSE) image of an area that includes the defect; and (c) determining a defect material element. The determining of the defect material element includes: determining whether an ambiguity exists in the electromagnetic emission spectrum, and resolving the ambiguity based on the BSE image, when it is determined that the ambiguity exists.

Abstract: A method for determining a defect material element, the method includes (a) acquiring, by a charged particle beam system and by applying a spectroscopy process, an electromagnetic emission spectrum of a part of a defect; (b) acquiring, by the charged particle beam system, a backscattered electron (BSE) image of an area that includes the defect; and (c) determining a defect material element. The determining of the defect material element includes: determining whether an ambiguity exists in the electromagnetic emission spectrum, and resolving the ambiguity based on the BSE image, when it is determined that the ambiguity exists.

Abstract: A system for electrically testing a semiconductor wafer, the system including (a) at least one charged particle beam focus effecting component and (b) at least one detector adapted to collect charged particles scattered from the wafer; wherein the system is adapted to scan a first area of a sample by a de-focused charged particle beam so as to affect a charging of the first area, scan at least a portion of the first area by a focused charged particle beam and detect electrons scattered from the at least portion. The system scans the at least portion while the first area remains affected by the de-focused charged particle beam.

Abstract: Herein are described layouts of test structures and scanning methodologies that allow large probe currents to be used so as to allow the detection of resistive defects with a resistance lower than 1 M? while at the same time allowing a sufficient degree of localization to be obtained for root cause failure analysis. The detection of resistances lower than 1 M? nominally requires a probe current greater than 1 micro ampere for detection on an electron beam inspection system.

Abstract: A system for electrically testing a semiconductor wafer, the system including (a) at least one charged particle beam focus effecting component and (b) at least one detector adapted to collect charged particles scattered from the wafer; wherein the system is adapted to scan a first area of a sample by a de-focused charged particle beam so as to affect a charging of the first area, scan at least a portion of the first area by a focused charged particle beam and detect electrons scattered from the at least portion. The system scans the at least portion while the first area remains affected by the de-focused charged particle beam.