Abstract: A multi-level fine wire tensioning apparatus is provided for use in high speed automatic wire bonders. The tensioning apparatus which surrounds the fine wire is mounted close to the bonding capillary and is adapted to apply one of a plurality of tension forces on the wire depending on the phase of the bonding cycle. The tensioning apparatus comprises a housing containing an aspirating tube which applies tension to the fine wire that is threaded through the tube. A controller is coupled to a high speed selector which connects one of a plurality of different level vacuum or pressure sources to the tensioning apparatus which in turn applies different tension forces to the fine wire in the capillary.

Abstract: A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be connected to a bonding head support. The wire clamp jaw mounting arm serves as a fixed lever to which is attached a first fixed flat surface clamping jaw and also serves as a mount to which a second and pivotal jaw is positioned juxtaposed the first jaw. A force mounting spring is also mounted on the mounting arm for applying a unidirectional force to one end of the second pivotal jaw to bias the pivotal jaw in a normally open or normally closed position.

Abstract: An ultrasonic transducer is provided with a wedge bonding tool having an arcuate convex working face. The wedge bonding tool is engaged on top of a foil finger of a connector to be spot bonded to a terminal or pad on a device or substrate. As force and ultrasonic power are applied to the bonding wedge it is rocked or pivoted about a pivot point on the working face of the wedge bonding tool to produce a rolling spot bond between the foil finger and the terminal or pad.