Patents by Inventor Eugene Y. Zhao

Eugene Y. Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for making reinforced wafer polishing pads and apparatuses implementing the same
    Patent number: 6949020
    Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: September 27, 2005
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Eugene Y. Zhao, Fen Dai
  • Apparatus for accurate endpoint detection in supported polishing pads
    Patent number: 6641470
    Abstract: An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has a polishing pad which is attached to a top surface of the support layer. Furthermore, the optical window structure has an optical window opening and a shaped optical window. The shaped optical window at least partially protrudes into the optical window opening in the support layer and the polishing pad during operation.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: November 4, 2003
    Assignee: Lam Research Corporation
    Inventors: Eugene Y. Zhao, Kang Jia, Michael David Steiman, Herbert Elliot Litvak, Christian David Frederickson
  • Methods for making reinforced wafer polishing pads and apparatuses implementing the same
    Publication number: 20030194963
    Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.
    Type: Application
    Filed: May 13, 2003
    Publication date: October 16, 2003
    Applicant: Lam Research Corporation.
    Inventors: Cangshan Xu, Eugene Y. Zhao, Fen Dai
  • Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
    Patent number: 6572463
    Abstract: A seamless polishing apparatus for utilization in chemical mechanical polishing is disclosed. The seamless polishing apparatus includes a base belt that has a reinforcement layer and a cushioning layer. The seamless polishing apparatus also includes a polishing pad that is attached to the base belt as a result of a direct casting of a polymeric precursor on a top surface of the cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: June 3, 2003
    Assignee: Lam Research Corp.
    Inventors: Cangshan Xu, Eugene Y. Zhao, Fen Dai
  • Methods for making reinforced wafer polishing pads and apparatuses implementing the same
    Patent number: 6561889
    Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer and a cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: May 13, 2003
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Eugene Y. Zhao, Fen Dai