Abstract: The present disclosure relates to an apparatus for preparing super-absorbent polymer (SAP) and a method for preparing SAP using the same. The apparatus for preparing SAP includes, a belt formed between two or more rotary shafts and traveling in a predetermined direction upon the rotation of the rotary shafts; and a feeding unit feeding a monomer composition to the belt, wherein the belt includes recess patterns at a bottom thereof.

Abstract: The present invention relates to an apparatus for cutting a super absorbent polymer and a method for preparing a super absorbent polymer using the same. The apparatus for cutting a super absorbent polymer of the present invention includes: an injection part for injecting a super absorbent polymer; a first cutter for primarily cutting the super absorbent polymer; a second cutter for secondarily cutting the super absorbent polymer; and a discharging part for discharging the cut super absorbent polymer.

Abstract: The present invention relates to a super absorbent resin cutting device and a super absorbent resin manufacturing method using the same. The super absorbent resin cutting device according to the present invention includes: an introduction unit for introducing a super absorbent resin; a cutter for cutting the super absorbent resin into pieces; and a discharge unit for discharging the super absorbent resin that has been cut.

Abstract: The present invention relates to a method for preparing a superabsorbent polymer. The method for preparing a superabsorbent according to the present invention includes the steps of: polymerizing a monomer composition into a superabsorbent polymer in a polymerization reactor; grinding the obtained superabsorbent polymer; and hydrolyzing the fine particles generated during the process and reusing the same for the monomer composition.

Abstract: The present invention relates to a method for preparing a superabsorbent polymer. The method for preparing a superabsorbent polymer according to the present invention includes the steps of: polymerizing monomer compositions in at least two polymerization reactors; grinding the polymers obtained in the polymerization step; drying the polymers; and mixing the polymers.

Abstract: An apparatus for manufacturing a super absorbent polymer, including: a belt installed over two or more rotary shafts and moved in a predetermined direction by the rotation of the rotary shafts; a supply unit supplying a monomer composition to the belt; and a cover covering at least a part of the belt and passing the belt from one side thereof to the other side thereof, wherein the belt includes a horizontal bottom, and lateral jaws provided at both ends of the belt at an angle of 30° to 70° to the horizontal bottom, and the cover includes heat inlets for supplying heat into the cover at both lateral sides thereof.

Abstract: There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent.

Abstract: The present invention provides a method of manufacturing a phosphorus-doped nickel nanoparticle. The method includes the steps of: mixing a nickel solution including a nickel compound and a solvent, a seed particle, and a phosphorus-containing reductant in an arbitrary order to prepare a mixed solution; and adjusting pH of the mixed solution such that the mixed solution becomes acidic. According to the method, a phosphorus-doped nickel nanoparticle that is suitable to be applied to solar cell electrodes requiring low contact resistance can be manufactured.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.

Abstract: The present invention provides a method of manufacturing a phosphorus-doped nickel nanoparticle. The method includes the steps of: mixing a nickel solution including a nickel compound and a solvent, a seed particle, and a phosphorus-containing reductant in an arbitrary order to prepare a mixed solution; and adjusting pH of the mixed solution such that the mixed solution becomes acidic. According to the method, a phosphorus-doped nickel nanoparticle that is suitable to be applied to solar cell electrodes requiring low contact resistance can be manufactured.

Abstract: The present invention relates to a solar cell and a method for preparing the same. The solar cell of the present invention comprises a first conductive type substrate; a second conductive type emitter layer which is located on the substrate and has a first opening; an anti-reflective film which is located on the emitter layer and has a second opening communicating with the first opening; a first electrode which fills the first opening and comprises phosphorus and nickel silicide; a second electrode which is formed on the first electrode, fills the second opening and comprises phosphorus and nickel; a front side electrode which is formed on the second electrode; and a back side electrode which is located on the rear side of the substrate.

Abstract: There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.