Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

Abstract: The present invention relates to a copper alloy production method and a method for manufacturing foil from a copper alloy, and the copper alloy production method of the present invention includes: a metal oxide preparing process of preparing at least two metals, including copper, each of which is in the form of a metal oxide, a nano powder producing process of pulverizing the metal oxides to produce metal oxide nano powder having a nano size, and an alloy producing process of heat-treating the metal oxide nano powder to produce an alloy, whereby, when a copper alloy is produced, precipitates can be minimized, the characteristics of the alloy can be optimized, and the generation of oxides on the outer wall of a molten metal furnace can be suppressed.

Abstract: A method for producing nickel nanopowder is introduced. For this, the present invention relates to a method for producing nickel nanopowder, including: (a) a step of preparing nickel oxide configured in the form of an oxide; (b) a nickel oxide nanopowder production step of pulverizing the nickel oxide so as to produce nano-sized nickel oxide nanopowder; (c) a step of drying the nickel oxide nanopowder; (d) a step of heat-treating the nickel oxide nanopowder so as to produce natural metal nickel nanopowder; and (e) a step of crushing the heat-treated nickel oxide nanopowder.

Abstract: Provided is a method for making nickel nanopowders into paste including: (a) preparing a nickel oxide configured in the form of an oxide; (b) preparing nano-sized nickel oxide nanopowders by pulverizing the nickel oxide; (c) a step of drying the nickel oxide nanopowders; (d) a step of preparing natural metal nickel nanopowders by preparing the nickel oxide nanopowders as the natural metal nickel nanopowders through a reduction process in a hydrogen atmosphere and heat-treating the same at the same time; (e) a step of simultaneously performing a step of crushing the natural metal nickel nanopowders prepared by the heat treatment and a nanopowder oxidation preventing coating step of forming an oxidation preventing film on the natural metal nickel nanopowders with an additive; and (f) a step of making the natural metal nickel nanopowders, which have been simultaneously subjected to the crushing and coating steps, into paste.

Abstract: Provided is a method for making nickel nanopowders into paste including: (a) preparing a nickel oxide configured in the form of an oxide; (b) preparing nano-sized nickel oxide nanopowders by pulverizing the nickel oxide; (c) a step of drying the nickel oxide nanopowders; (d) a step of preparing natural metal nickel nanopowders by preparing the nickel oxide nanopowders as the natural metal nickel nanopowders through a reduction process in a hydrogen atmosphere and heat-treating the same at the same time; (e) a step of simultaneously performing a step of crushing the natural metal nickel nanopowders prepared by the heat treatment and a nanopowder oxidation preventing coating step of forming an oxidation preventing film on the natural metal nickel nanopowders with an additive; and (f) a step of making the natural metal nickel nanopowders, which have been simultaneously subjected to the crushing and coating steps, into paste.

Abstract: A method for producing nickel nanopowder is introduced. For this, the present invention relates to a method for producing nickel nanopowder, including: (a) a step of preparing nickel oxide configured in the form of an oxide; (b) a nickel oxide nanopowder production step of pulverizing the nickel oxide so as to produce nano-sized nickel oxide nanopowder; (c) a step of drying the nickel oxide nanopowder; (d) a step of heat-treating the nickel oxide nanopowder so as to produce natural metal nickel nanopowder; and (e) a step of crushing the heat-treated nickel oxide nanopowder.

Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

Abstract: The present invention relates to a copper alloy production method and a method for manufacturing foil from a copper alloy, and the copper alloy production method of the present invention includes: a metal oxide preparing process of preparing at least two metals, including copper, each of which is in the form of a metal oxide, a nano powder producing process of pulverizing the metal oxides to produce metal oxide nano powder having a nano size, and an alloy producing process of heat-treating the metal oxide nano powder to produce an alloy, whereby, when a copper alloy is produced, precipitates can be minimized, the characteristics of the alloy can be optimized, and the generation of oxides on the outer wall of a molten metal furnace can be suppressed.

Abstract: The present invention has been proposed to resolve the above-described problems, and it is an objective of the present invention to provide a heat dissipation sheet with excellent heat dissipation properties, which has a specific porosity, exhibits excellent horizontal heat conductivity, and exhibits an excellent effect in peel strength, and a manufacturing method thereof.

Abstract: The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

Abstract: The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.

Abstract: The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

Abstract: The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.