Patents by Inventor Eui-Jung Jang

Eui-Jung Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME
    Publication number: 20240174890
    Abstract: A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the same, the composition includes a polar solvent or a nonpolar solvent; an abrasive agent; and a compound represented by Formula 3 or a complex thereof:
    Type: Application
    Filed: October 24, 2023
    Publication date: May 30, 2024
    Inventors: Keun Sam JANG, Won Jung KIM, Tae Won PARK, Ji Ho LEE, Eui Rang LEE, Jin Gyo KIM, Dong Hyeon LEE, Chang Suk LEE
  • Electronic device
    Patent number: D767562
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eui-Jung Jang, Ki-Seong Kim