Abstract: An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, ?, is disclosed. The EM device includes: an integrated circuit, IC, chip (2000); and, a DRA subarray (3000) integrally arranged with and disposed on the IC chip (2000). The DRA subarray (3000) includes a plurality of DRAs (3100), that can resonate at the same frequency, f, defining a unit cell (3200) having an overall footprint (3300) of equal to or less than ?/2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100?) of the plurality of DRAs (3100).

Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

Abstract: In an aspect, a method of forming a coating on a busbar comprises cold spraying a powder comprising a plurality of metal particles onto the busbar at a velocity sufficiently high to cause the plurality of metal particles to deform upon contact with the busbar thereby forming the coating on the busbar; wherein the plurality of metal particles comprises greater than or equal to 50 weight percent of at least one of nickel, tin, silver, zinc, or copper based on the total weight of the metal particles; and wherein the coating has an average thickness of greater than or equal to 10 micrometers. In another aspect, a coated busbar is formed by cold spraying.

Abstract: In an aspect, a layered phase change composite comprises a phase change layer comprising a phase change material, a plurality of boron nitride particles, and a binder; and a first capping layer and a second capping layer located on opposing sides of the phase change layer. In another aspect, a method of making the layered phase change composite comprises forming the first capping layer from a first composition; forming the phase change layer from a phase change composition, wherein the forming the phase change layer comprises vibrating the phase change composition on a 3-directional vibration stage; and forming the second capping layer from a second composition.

Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

Abstract: In an embodiment, a method of forming a magneto-dielectric material comprises roll coating a ferromagnetic material onto a dielectric layer comprising a dielectric material by continuously moving the dielectric layer through a ferromagnetic coating zone to form a coated sheet; forming a plurality of sheets from the coated sheet; forming a layered stack of the plurality of sheets; laminating the layered stack to form the magneto-dielectric material having a plurality of alternating ferromagnetic layers and dielectric layers. In another embodiment, a method of forming a magneto-dielectric material comprises drum roll coating a ferromagnetic material and a dielectric material onto a drum roll to form the magneto-dielectric material having a plurality of alternating ferromagnetic layers and dielectric layers.

Abstract: An optical media such as an optical tape includes a substrate, a pre-format layer on one side of the substrate, and a back side coating. The back side coating is optically transparent and is electrically conductive. One of the substrate and the pre-format layer is between the back side coating and the other one of the substrate and the pre-format layer.

Abstract: An optical media such as an optical tape includes a substrate, a pre-format layer on one side of the substrate, and a back side coating. The back side coating is optically transparent and is electrically conductive. One of the substrate and the pre-format layer is between the back side coating and the other one of the substrate and the pre-format layer.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract: A method for forming an optical tape for data storage from a substrate film includes a step of patterning a curable liquid composition onto a side of the substrate film. Characteristically, the curable liquid composition includes a free radical photoinitiator and a polymerizable component that includes at least one acrylate. The curable liquid composition is illuminated with actinic radiation to form a patterned imprint layer disposed over the substrate film. A multilayer data recording assembly is placed over the imprint layer. An optical tape made by the method is also provided.

Abstract: A method for forming an optical tape for data storage from a substrate film includes a step of patterning a curable liquid composition onto a side of the substrate film. Characteristically, the curable liquid composition includes a cationic photoinitiator and a polymerizable component selected from the group consisting of vinyl ethers, cyclohexene oxides, glycidyl ether epoxides, and combinations thereof. The curable liquid composition is illuminated with actinic radiation to form a patterned imprint layer disposed over the substrate film. A multilayer data recording assembly is placed over imprint layer. An optical tape made by the method is also provided.

Abstract: The present invention comprises a method of reducing photoresist mask collapse when the photoresist mask is dried after immersion development. As feature sizes continue to shrink, the capillary force of water used to rinse a photoresist mask approaches the point of being greater than adhesion force of the photoresist to the ARC. When the capillary force exceeds the adhesion force, the features of the mask may collapse because the water pulls adjacent features together as the water dries. By depositing a hermetic oxide layer over the ARC before depositing the photoresist, the adhesion force may exceed the capillary force and the features of the photoresist mask may not collapse.

Abstract: A method and structure for the fabrication of semiconductor devices having feature sizes in the range of 90 nm and smaller is provided. In one embodiment of the invention, a method is provided for processing a substrate including depositing an anti-reflective coating layer on a surface of the substrate, depositing an adhesion promotion layer on the anti-reflective coating layer, and depositing a resist material on the adhesion promotion layer. In another embodiment of the invention, a semiconductor substrate structure is provided including a dielectric substrate, an amorphous carbon layer deposited on the dielectric layer, an anti-reflective coating layer deposited on the amorphous carbon layer, an adhesion promotion layer deposited on the anti-reflective coating layer, and a resist material deposited on the adhesion promotion layer.

Abstract: The present invention comprises a method of reducing photoresist mask collapse when the photoresist mask is dried after immersion development. As feature sizes continue to shrink, the capillary force of water used to rinse a photoresist mask approaches the point of being greater than adhesion force of the photoresist to the ARC. When the capillary force exceeds the adhesion force, the features of the mask may collapse because the water pulls adjacent features together as the water dries. By depositing a hermetic oxide layer over the ARC before depositing the photoresist, the adhesion force may exceed the capillary force and the features of the photoresist mask may not collapse.

Abstract: The present invention comprises an apparatus and method for etching at a substrate edge region. In one embodiment, the apparatus comprises a chamber having a process volume, a substrate support arranged inside the process volume and having a substrate support surface, a plasma generator coupled to the chamber and configured to supply an etching agent in a plasma phase to a peripheral region of the substrate support surface, and a gas delivery assembly coupled to a gas source for generating a radial gas flow over the substrate support surface from an approximately central region of the substrate support surface toward the peripheral region of the substrate support surface.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract: The present invention provides a composition and a method for forming a pattern on a substrate with the composition by forming a cross-linked polymer from the composition upon exposing the same to radiation. The viscosity and wetting properties of the composition are selected to facilitate formation of a layer from a plurality of spaced-apart beads of the material disposed on the substrate. To that end, in one embodiment of the present invention the composition includes a mono-functional acrylate component, a poly-functional molecule component, and an initiator component responsive to the radiation to initiate a free radical reaction to cause the mono-functional acrylate component and the poly-functional molecule component to polymerize and crosslink.