Patents by Inventor Eui Sang Lim

Eui Sang Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12014938
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: June 18, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Yong Hee Lee, Young Hun Lee, Jinwoo Jung, Eui Sang Lim
  • Publication number: 20240145261
    Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Eui Sang LIM, Young Hun LEE, Jinwoo JUNG, Miso PARK, Byongwook AHN, Yong Hee LEE
  • Patent number: 11942337
    Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: March 26, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Eui Sang Lim, Young Hun Lee, Jinwoo Jung, Miso Park, Byongwook Ahn, Yong Hee Lee
  • Publication number: 20230187230
    Abstract: A substrate processing apparatus includes a chamber body providing a processing space for drying a substrate with a drying fluid in a supercritical state, a substrate support chuck supporting the substrate in the processing space, a fluid supply unit including a fluid supply line configured to supply the drying fluid to the processing space, and a supply line heating unit configured to heat the fluid supply line.
    Type: Application
    Filed: December 8, 2022
    Publication date: June 15, 2023
    Applicant: SEMES CO., LTD.
    Inventor: Eui Sang LIM
  • Publication number: 20230018637
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 19, 2023
    Inventors: YONG HEE LEE, YOUNG HUN LEE, JINWOO JUNG, EUI SANG LIM
  • Patent number: 11495474
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 8, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Yong Hee Lee, Young Hun Lee, Jinwoo Jung, Eui Sang Lim
  • Publication number: 20220351968
    Abstract: A method for treating a substrate is provided. The method includes the following steps: performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate. A treating fluid flows through a treating fluid supplying regulator regulating an amount of the treating fluid before dispensed onto the substrate. The treating fluid is heated to a set temperature or more by a first heater before passing through the treating fluid supplying regulator, and the treating fluid is heated by a second heater when the treating fluid is passed through the treating fluid supplying regulator. The temperature of the treating fluid is lowered in rear region of the treating fluid supplying regulator. The set temperature is a temperature that allows the lowered temperature to be maintained at a critical temperature or more.
    Type: Application
    Filed: July 19, 2022
    Publication date: November 3, 2022
    Inventors: JINWOO JUNG, YOUNG HUN LEE, YONG HEE LEE, EUI SANG LIM
  • Publication number: 20220208564
    Abstract: A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 30, 2022
    Applicant: SEMES CO., LTD.
    Inventors: EUI SANG LIM, YONG HEE LEE
  • Publication number: 20220090859
    Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.
    Type: Application
    Filed: August 23, 2021
    Publication date: March 24, 2022
    Applicant: SEMES CO., LTD.
    Inventors: DO HYEON YOON, YONG HYUN CHOI, EUI SANG LIM, JUN YOUNG CHOI
  • Publication number: 20220020609
    Abstract: An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.
    Type: Application
    Filed: July 8, 2021
    Publication date: January 20, 2022
    Applicant: SEMES CO., LTD.
    Inventors: Miso PARK, Yong Hee LEE, Eui Sang LIM, Jinwoo JUNG
  • Patent number: 11145520
    Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 12, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Young Hun Lee, Eui Sang Lim
  • Patent number: 11020777
    Abstract: A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: June 1, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Young Hun Lee, Eui Sang Lim, Jae Myoung Lee
  • Publication number: 20210104417
    Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 8, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Eui Sang LIM, Young Hun LEE, Jinwoo JUNG, Miso PARK, Byongwook AHN, Young Hee LEE
  • Publication number: 20210005470
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: YONG HEE LEE, YOUNG HUN LEE, JINWOO JUNG, EUI SANG LIM
  • Publication number: 20200335364
    Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: YOUNG HUN LEE, EUI SANG LIM
  • Publication number: 20200101501
    Abstract: A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 2, 2020
    Inventors: Young Hun LEE, Eui Sang LIM, Jae Myoung LEE
  • Publication number: 20200027724
    Abstract: An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 23, 2020
    Inventors: JINWOO JUNG, YOUNG HUN LEE, YONG HEE LEE, EUI SANG LIM
  • Publication number: 20190164787
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 30, 2019
    Inventors: YONG HEE LEE, YOUNG HUN LEE, JINWOO JUNG, EUI SANG LIM
  • Patent number: 9978584
    Abstract: A method for treating a substrate, in which a supercritical fluid is supplied into a chamber, in which the substrate is carried, to treat the substrate, the method including a supply step of supplying the supercritical fluid into the chamber until a pressure of the interior of the chamber reaches a preset pressure, and a substrate treating step of performing a supercritical process while repeating supply and exhaust of the supercritical fluid into and out of the interior of the chamber after the supply step, wherein a flow rate of the supercritical fluid supplied into the chamber in the supply step is variable.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: May 22, 2018
    Assignee: SEMES CO., LTD.
    Inventors: Young Hun Lee, Eui Sang Lim, Min Jun Cho, Jae Myoung Lee
  • Publication number: 20180012755
    Abstract: A method for treating a substrate, in which a supercritical fluid is supplied into a chamber, in which the substrate is carried, to treat the substrate, the method including a supply step of supplying the supercritical fluid into the chamber until a pressure of the interior of the chamber reaches a preset pressure, and a substrate treating step of performing a supercritical process while repeating supply and exhaust of the supercritical fluid into and out of the interior of the chamber after the supply step, wherein a flow rate of the supercritical fluid supplied into the chamber in the supply step is variable.
    Type: Application
    Filed: August 30, 2016
    Publication date: January 11, 2018
    Inventors: Young Hun Lee, Eui Sang Lim, Min Jun Cho, Jae Myoung Lee