Patents by Inventor Eul-bin Im

Eul-bin Im has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked intelligent power module package
    Patent number: 6574107
    Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: June 3, 2003
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung-jin Kim, Eul-bin Im, Byeong Gon Kim
  • Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
    Patent number: 6432750
    Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: August 13, 2002
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-young Jeon, Eul-bin Im, Byeong Gon Kim, Eun-ho Lee
  • Stacked intelligent power module package
    Publication number: 20020057553
    Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
    Type: Application
    Filed: February 26, 2001
    Publication date: May 16, 2002
    Applicant: Fairchild Korea Semiconductor Ltd.
    Inventors: O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung-jin Kim, Eul-bin Im, Byeong Gon Kim
  • Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
    Publication number: 20010052639
    Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
    Type: Application
    Filed: February 22, 2001
    Publication date: December 20, 2001
    Applicant: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-young Jeon, Eul-bin Im, Byeong Gon Kim, Eun-ho Lee