Patents by Inventor Eun Byeol CHOI

Eun Byeol CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250201481
    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the body including a central portion including dielectric layers and internal electrodes, and an outer portion covering the central portion, and an external electrode including a connection portion disposed on the third or fourth surfaces and a band portion extending from the connection portion to the first and second surfaces. The external electrode includes a glass layer disposed in the band portion, a base electrode layer disposed in the connection portion, and a conductive resin layer. A portion of the glass layer is disposed in the connection portion, and an end of the glass layer disposed in the connection portion is disposed on the outer portion.
    Type: Application
    Filed: November 1, 2024
    Publication date: June 19, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Ah KIM, Hyun Hee GU, Kangha LEE, Eun Byeol CHOI, Hong Je CHOI, Hong Seok KIM
  • Publication number: 20240186069
    Abstract: An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.
    Type: Application
    Filed: September 19, 2023
    Publication date: June 6, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Jin Soo PARK, Yoona PARK, So Eun CHOI, Eun Byeol CHOI, Chul Seung LEE
  • Publication number: 20240177933
    Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.
    Type: Application
    Filed: September 29, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Yoona PARK, So Eun CHOI, Eun Byeol CHOI, Chul Seung LEE