Abstract: The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.

Abstract: A backlight assembly a plurality of first light-emitting chips for emitting light and a thermistor for indicating the temperature of the first light-emitting chips. The first light-emitting chips emit first color light and are connected in series to each other. The thermistor may be connected in series to the first light-emitting chips and has an electrical resistance that decreases with an increase of its temperature. The light amount emitted by the first light-emitting chips is controlled by pulse width modulating the current driving the first light-emitting chips based on the temperature (resistance) of the thermistor and based on received image data. Thus, a decrease in brightness due to temperature variation may be compensated for while performing color dimming.

Abstract: A light source device, including a substrate, a plurality of light emitting diode chips mounted on the substrate, and an encapsulant covering the plurality of light emitting diode chips. The encapsulant has a plurality of lenses connected to each other and each lens corresponds to one of the plurality of light emitting diode chips.

Abstract: In a backlight assembly, a reflector member includes a base sheet reflecting a light and a connecting line disposed on a face of the base sheet and, and transmitting signals. An input pad is disposed at a first end portion of the connecting line and receives the signals, and an output pad is disposed at a second end portion of the connecting line and outputs the signals transmitted through the connecting line.

Abstract: A backlight assembly includes a circuit board and a plurality of point light source groups. The plurality of point light source groups includes N point light sources that generate different respective colors and being arranged on the circuit board. Here, N is a number of point light sources. One light source group of the light source groups is rotated by an angle of predetermined degrees in a clockwise direction or a counter-clockwise direction with respect to another light source group that is adjacent to the one point light source group.

Abstract: A light-emitting device includes a substrate on which at least one light source region is defined, the light source region having one or more sub-light source regions that are separated from one another by a gap, a plurality of electrode patterns which are respectively formed in the sub-light source regions, a plurality of light-emitting chips which are respectively connected to the electrode patterns, and a plurality of passivations which respectively cover the light-emitting chips, wherein the passivations are separated from each other by the gap. The light-emitting device is thus capable of improving the mixing of light generated by light-emitting chips and the dissipation of heat generated by light-emitting chips.

Abstract: In accordance with embodiments of the present disclosure, a backlight unit assembly is provided with a lamp and a light emitting diode (LED) periodically turned on and off, and a liquid crystal display having the backlight unit assembly. A light source is configured with both the lamp and the LED, and the LED is periodically turned on and off by applying a start signal, which are capable of removing image sticking on a liquid crystal display (LCD) panel. This feature may reduce power consumption and increase contrast ratio. The backlight unit assembly and the LCD are capable of adjusting a chromaticity coordinate of the light source to a reference chromaticity coordinate.

Abstract: A backlight assembly a plurality of first light-emitting chips for emitting light and a thermistor for indicating the temperature of the first light-emitting chips. The first light-emitting chips emit first color light and are connected in series to each other. The thermistor may be connected in series to the first light-emitting chips and has an electrical resistance that decreases with an increase of its temperature. The light amount emitted by the first light-emitting chips is controlled by pulse width modulating the current driving the first light-emitting chips based on the temperature (resistance) of the thermistor and based on received image data. Thus, a decrease in brightness due to temperature variation may be compensated for while performing color dimming.

Abstract: In a backlight assembly, a reflector member includes a base sheet reflecting a light and a connecting line disposed on a face of the base sheet and, and transmitting signals. An input pad is disposed at a first end portion of the connecting line and receives the signals, and an output pad is disposed at a second end portion of the connecting line and outputs the signals transmitted through the connecting line.

Abstract: The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.

Abstract: A light source device, including a substrate, a plurality of light emitting diode chips mounted on the substrate, and an encapsulant covering the plurality of light emitting diode chips. The encapsulant has a plurality of lenses connected to each other and each lens corresponds to one of the plurality of light emitting diode chips.

Abstract: A backlight assembly includes a plurality of point light source substrates each including a substrate main body, a power supplying line disposed on the substrate main body, and a pad part disposed on the substrate main body and electrically connected to the power supplying line, a point light source disposed on each of the point light source substrates and supplied with power through the power supplying line, and a connecting film connecting adjacent point light source substrates and including a first film main body and a metal pattern disposed on the first film main body and electrically connected with the pad part.

Abstract: A backlight assembly includes a circuit board and a plurality of point light source groups. The plurality of point light source groups includes N point light sources that generate different respective colors and being arranged on the circuit board. Here, N is a number of point light sources. One light source group of the light source groups is rotated by an angle of predetermined degrees in a clockwise direction or a counter-clockwise direction with respect to another light source group that is adjacent to the one point light source group.