Abstract: Methods are provided including methods of promoting growth vigor in plants. In one embodiment, a method for promoting growth vigor in a plant comprises providing a plant comprising a circadian clock gene; and modifying expression of the circadian clock gene or modifying activity of a protein produced by the circadian clock gene so as to modify a flowering time of the plant; modify a starch, sugar, chlorophyll, metabolite, or nutrient content of the plant, or increase biomass or yield of the plant. In some embodiments, methods are provided including preparing a transgenic plant and using circadian clock genes as DNA and/or expression markers to select and predict the best combinations of parents to make hybrid plants with enhanced vigor.

Abstract: Methods are provided including methods of promoting growth vigor in plants. In one embodiment, a method for promoting growth vigor in a plant comprises providing a plant comprising a circadian clock gene; and modifying expression of the circadian clock gene or modifying activity of a protein produced by the circadian clock gene so as to modify a flowering time of the plant; modify a starch, sugar, chlorophyll, metabolite, or nutrient content of the plant, or increase biomass or yield of the plant. In some embodiments, methods are provided including preparing a transgenic plant and using circadian clock genes as DNA and/or expression markers to select and predict the best combinations of parents to make hybrid plants with enhanced vigor.

Abstract: A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. Additionally, the lead frame and the sealing part are sized and configured relative to each other so as to maximize the contact area therebetween, thus having the effect of improving the bonding strength between the lead frame and the sealing part. This increased contact area between the sealing part and the lead frame also maximizes the lengths of those passages susceptible to moisture permeation, thus minimizing such moisture permeation potential.

Abstract: A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. Additionally, the lead frame and the sealing part are sized and configured relative to each other so as to maximize the contact area therebetween, thus having the effect of improving the bonding strength between the lead frame and the sealing part. This increased contact area between the sealing part and the lead frame also maximizes the lengths of those passages susceptible to moisture permeation, thus minimizing such moisture permeation potential.