Patents by Inventor Eun Dong Jin

Eun Dong Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Package
    Publication number: 20250062200
    Abstract: In one aspect of the present invention, the connection pin comprises a columnar structure with a diameter ranging from 60 to 500 micrometers (?m) and an aspect ratio (length to diameter) ranging from 1 to 10. Furthermore, the angle formed between the horizontal and vertical surfaces of the said structure is characterized by being between 90°±3°.
    Type: Application
    Filed: December 7, 2023
    Publication date: February 20, 2025
    Inventors: Oh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Park Eun Kwang, Kim Jin-Gyu, Lee Chan-Gyu
  • Connection Pin
    Publication number: 20250062559
    Abstract: In one aspect of the present invention, the connection pin comprises a columnar structure with a diameter ranging from 60 to 500 micrometers (?m) and an aspect ratio (length to diameter) ranging from 1 to 10. Furthermore, the angle formed between the horizontal and vertical surfaces of the said structure is characterized by being between 90°±3°.
    Type: Application
    Filed: December 7, 2023
    Publication date: February 20, 2025
    Inventors: Oh Heebong, Park Soon-Ho, Eun Dong Jin, Lee Jae-Ki, Lee Tae-Hyun, Kim Kyung Tae, Park Eun Kwang, Kim Jin-Gyu
  • Solder Paste for Connection Pin
    Publication number: 20250058413
    Abstract: In one aspect of the present invention, a solder paste for connection pins is provided, comprising: solder powder that includes tin, has a mean diameter of 3˜5 ?m, and wherein the proportion of powder particles with a diameter of 8 ?m or more is less than 1 wt %; and a flux that enhances the wettability of the aforementioned solder powder.
    Type: Application
    Filed: December 7, 2023
    Publication date: February 20, 2025
    Inventors: Oh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Kim Kyung Tae, Kim Jin-Gyu, Kim Min-Woo
  • CONNECTING PILLAR
    Publication number: 20240096832
    Abstract: An aspect of the present invention provides a metal pillar in a columnar shape formed by cutting a metal wire to a predetermined length. The metal pillar has a burr length of 0.1 to 0.5 ?m on the cutting surface and provide a connecting pillar that has a solder layer on at least one area of the outer surface of the metal pillar, which comprises Sn, Cu, and Ag.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 21, 2024
    Applicant: DUKSAN HI METAL CO., LTD.
    Inventors: Eun Dong Jin, LEE HYUNKYU, Kim Kyung Tae, Bae Sung Moon, Park Eun Kwang, Seong Taek Kim, Kim Jin-Gyu, CHU YONGCHEOL, OH HEEBONG
  • METAL PILLAR FOR CONDUCTIVE CONNECTION
    Publication number: 20240088079
    Abstract: An aspect of the present invention provides a metal pillar in a columnar shape formed by cutting a metal wire to a predetermined length. The metal pillar has a burr length of 0.1 to 0.5 ?m on the cutting surface, an electrical conductivity of 11 to 101% IACS, and a Vickers hardness of 150 to 300 HV.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 14, 2024
    Applicant: DUKSAN HI METAL CO., LTD.
    Inventors: Eun Dong Jin, LEE HYUNKYU, Kim Kyung Tae, Bae Sung Moon, Park Eun Kwang, Seong Taek Kim, Kim Jin-Gyu, CHU YONGCHEOL, OH HEEBONG