Patents by Inventor Eun Heay Lee

Eun Heay Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with electronic component embedded therein
    Patent number: 11490503
    Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun Lee, Deok Man Kang, Jin Oh Park
  • SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
    Publication number: 20220022310
    Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
    Type: Application
    Filed: March 17, 2021
    Publication date: January 20, 2022
    Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun LEE, Deok Man Kang, Jin Oh Park
  • Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
    Patent number: 8946911
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: February 3, 2015
    Assignee: Samsung Electro-Machanics Co., Ltd.
    Inventors: Jung Youn Pang, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20150027760
    Abstract: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.
    Type: Application
    Filed: November 21, 2013
    Publication date: January 29, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS., LTD.
    Inventors: Seong Min CHO, Jung Youn PANG, Eun Heay LEE, Seung Min KANG
  • ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    Publication number: 20140087205
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Application
    Filed: December 6, 2012
    Publication date: March 27, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Youn PANG, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim