Patents by Inventor Eun-Hee An

Eun-Hee An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107373
    Abstract: Provided is a communication method and an electronic device performing the communication method. The communication method includes establishing a wireless connection for transmission of data, generating a medium access control (MAC) frame including a header formed only of a frame control field based on a type of the data, and transmitting the MAC frame including the data.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 28, 2024
    Inventors: Jae Sun CHA, Tae Joon PARK, Eun-Hee KIM, Kyeseon LEE
  • Publication number: 20240097218
    Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Min Kyu Sim, Jong Seok Park, Min Su Kim, Jae Hwan Lee, Ki Deok Han, Eun Ji Jo, Su Wan Park, Gi Yeong Jeon, June Hee Kim, Wi Dae Park, Dong Min Seo, Seol Hee Kim, Dong Yeop Lee, Jun Hyo Su, Byoung Eun Han, Seung Huh
  • Publication number: 20240093338
    Abstract: The present disclosure relates to a healable superplastic amorphous alloy, and specifically, to a healable superplastic amorphous alloy capable of exhibiting superplastic behavior and unique healable behavior by maximizing the complexity of the amorphous structure for an Icosahedral quenched-in nuclei quasi-crystal cluster to be formed in the amorphous matrix through the composition limitation and additive element control of Zr—Cu—Ni—Al alloy.
    Type: Application
    Filed: January 16, 2023
    Publication date: March 21, 2024
    Inventors: Eun Soo PARK, Geun Hee YOO, Wook Ha RYU, Myeong Jun LEE, Min Kyung KWAK
  • Publication number: 20240092228
    Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.
    Inventors: Jung Sang YOU, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Patent number: 11932140
    Abstract: Disclosed is a cushion tip-up type seat for a vehicle. The cushion tip-up type seat for a vehicle is configured to perform a tip-up function of a cushion part, and to move a seat leftward and rightward to adjust an interval between left and right seats, whereby left and right spacing between occupants seated in the seats is sufficiently secured and the convenience of the occupants is improved.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: March 19, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.
    Inventors: Dong Woo Jeong, Eun Sue Kim, Dae Hee Lee, Myung Hoe Kim, Jun Sik Hwang, Gwon Hwa Bok, Hae Dong Kwak, Jae Sung Shin, Han Kyung Park, Jae Hoon Cho
  • Patent number: 11935984
    Abstract: A quantum dot including a core that includes a first semiconductor nanocrystal including zinc and selenium, and optionally sulfur and/or tellurium, and a shell that includes a second semiconductor nanocrystal including zinc, and at least one of sulfur or selenium is disclosed. The quantum dot has an average particle diameter of greater than or equal to about 13 nm, an emission peak wavelength in a range of about 440 nm to about 470 nm, and a full width at half maximum (FWHM) of an emission wavelength of less than about 25 nm. A method for preparing the quantum dot, a quantum dot-polymer composite including the quantum dot, and an electronic device including the quantum dot is also disclosed.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Seok Han, Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang
  • Publication number: 20240090321
    Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, an organic electroluminescent device having improved driving voltage, power efficiency and/or lifetime characteristics compared to conventional organic electroluminescent devices can be provided.
    Type: Application
    Filed: July 17, 2023
    Publication date: March 14, 2024
    Inventors: So-Young JUNG, Hyun-Ju KANG, Sang-Hee CHO, Tae-Jun HAN, Hyo-Nim SHIN, Eun-Joung CHOI
  • Patent number: 11925044
    Abstract: A light emitting device includes: a first electrode and a second electrode facing each other, an emissive layer disposed between the first electrode and the second electrode and including a quantum dot, an electron auxiliary layer disposed between the emissive layer and the second electrode and including a plurality of nanoparticles, and a polymer layer between a portion of the second electrode and the electron auxiliary layer, wherein the nanoparticles include a metal oxide including zinc, wherein the second electrode has a first surface facing a surface of the electron auxiliary layer and a second surface opposite to the first surface, and the polymer layer is disposed on a portion of the second surface and a portion of the surface of the electron auxiliary layer, and wherein the polymer layer includes a polymerization product of a thiol compound and an unsaturated compound having at least two carbon-carbon unsaturated bonds.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Ho Kim, Won Sik Yoon, Jeong Hee Lee, Eun Joo Jang, Oul Cho
  • Patent number: 11923145
    Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1<A2/M1?1.5 and A2<A1 in which A1 is an average grain size of the dielectric layers in a central region of the active portion, A2 is an average grain size of the dielectric layers at an active boundary part of the active portion adjacent to the side margin portion, and M1 is an average grain size of the dielectric layers in a central region of the side margin portion.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hee Lee, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hyoung Uk Kim, Jae Sung Park
  • Publication number: 20240067056
    Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.
    Type: Application
    Filed: March 6, 2023
    Publication date: February 29, 2024
    Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Patent number: 11895603
    Abstract: An operation method of an access point (AP) and a terminal, in a wireless time sensitive network (WTSN), may comprise: receiving, by an AP, an uplink frame from a first terminal; generating compensation indication information for compensation to be performed in the first terminal according to channel information between the first terminal and the AP estimated based on the uplink frame; transmitting the compensation indication information to the first terminal through a downlink frame; and performing, by the first terminal, the compensation based on the compensation indication message transmitted through the downlink frame.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: February 6, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Tae Joon Park, Eun Hee Kim, Jae Sun Cha, Jung Hoon Oh, Kye Seon Lee
  • Publication number: 20240034646
    Abstract: Provided is a UV reaction apparatus for treating waste liquid caused by system decontamination in a nuclear power plant. The UV reaction apparatus comprises a UV irradiation unit for irradiating UV light as a bar-shaped body; and a transit unit accommodating the UV irradiation unit therein, and for passing organic waste liquid to be irradiated with the UV light, wherein the transit unit comprises, an input unit, into which the organic waste liquid is input a discharge unit, through which the organic waste liquid is discharged, and an intermediate unit located between the input unit and the discharge unit, and in which the UV irradiation unit is located.
    Type: Application
    Filed: March 4, 2022
    Publication date: February 1, 2024
    Applicant: KOREA HYDRO & NUCLEAR POWER CO., LTD
    Inventors: Cho Rong KIM, Hak Soo KIM, Jeong Ju KIM, Sang Ho LEE, Eun Hee HONG, Ji Eun PARK, Ka Hee JEONG
  • Publication number: 20240025950
    Abstract: The invention relates to a purification method of a recombinantly-produced RSV F protein in trimeric form. According to the invention, the method sequentially comprises an anion exchange chromatography step, a cHA chromatography step and a HIC step. The invention is also directed to a pharmaceutical product including an RSV F protein purified by such a method.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 25, 2024
    Inventors: Ping Cai, Eun Hee Koh, Eugene Joseph Vidunas, Michele L. Weaver, Xinhao Ye, Yonghui Yuan, Jay Zhixing Zhao
  • Patent number: 11862457
    Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: SeongKeun Cho, Young Hoo Kim, Seung Min Shin, Tae Min Earmme, Kun Tack Lee, Hun Jae Jang, Eun Hee Jeang
  • Publication number: 20230416683
    Abstract: The present invention relates to: a method in which extracellular vesicles with improved therapeutic efficacy are produced from a three-dimensional spheroid-type cell aggregate produced using a microwell having a particular structure; and extracellular vesicles produced by the production method. When the method for producing extracellular vesicles, according to the present invention, is used, extracellular vesicles having enhanced efficacy can be mass-produced, and the produced extracellular vesicles include higher levels of various efficiency factors than existing extracellular vesicles and exhibit uniform characteristics without difference between donors, and thus can be used for various purposes in the medical industry.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 28, 2023
    Inventors: Eun Hee Kim, Eun Kyoung Shin, Ji Hee Sung
  • Publication number: 20230326678
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is a, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is b, b/a is 0.07 or more.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Hee JEONG, Min Hyang KIM, Dong Yeong KIM, Chae Min PARK
  • Patent number: 11769726
    Abstract: A semiconductor device includes a first gate electrode disposed on a substrate and extending in a first horizontal direction, a first gate contact and a dummy gate contact, which are spaced apart from each other in the first horizontal direction and are in contact with a top surface of the first gate electrode, a first interconnect line extending in a second horizontal direction and overlapping the first gate contact in a vertical direction with respect to the upper surface of the substrate, and a voltage generator configured to generate a first voltage and apply the first voltage to the first gate electrode via the first interconnect line and the first gate contact. The first gate electrode receives the first voltage via the first interconnect line and the first gate contact from the voltage generator. The dummy gate contact receives the first voltage via the first gate electrode.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byounggon Kang, Changbeom Kim, Dalhee Lee, Eun-Hee Choi
  • Publication number: 20230282624
    Abstract: An integrated circuit chip includes; a package substrate including a first signal ball, a first semiconductor chip on the package substrate, a second semiconductor chip on the first semiconductor chip, a first bump disposed between the package substrate and the first semiconductor chip and electrically connected to the first signal ball, and a second bump disposed between the first semiconductor chip and the second semiconductor chip and electrically connected to the first signal ball, wherein during a first mode, the first signal ball receives a signal from the first semiconductor chip through the first bump and receives a signal from the second semiconductor chip through the second bump.
    Type: Application
    Filed: November 25, 2022
    Publication date: September 7, 2023
    Inventors: BONG WEE YU, EUN-HEE KIM, KYOUNG-MIN LEE
  • Patent number: 11735367
    Abstract: A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Young Jeong, Jin Mo Ahn, Eun Hee Jeong, Ga Young An
  • Patent number: D995503
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: August 15, 2023
    Assignee: SPIGEN KOREA CO., LTD.
    Inventors: Eun Hee Koo, Jung Hun Kwak