Patents by Inventor Eun Heui CHOI

Eun Heui CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10012853
    Abstract: The present invention relates to a flexible substrate bonding method and, more particularly, to a bonding method for bonding a flexible substrate to a carrier substrate in order to facilitate handling of the flexible substrate. To this end, the present invention provides a flexible substrate bonding method comprising: a substrate preparation step for preparing a carrier substrate and a flexible substrate; and a bonding step for bonding the carrier substrate to the flexible substrate, which rotates by being wound around a rotation roll, while moving the carrier substrate by a transfer unit, wherein the bonding step includes bringing one edge of the flexible substrate into contact with the carrier substrate, and then gradually bonding the flexible substrate to the carrier substrate in a direction from one side to the other side.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: July 3, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Gyung Soo Kang, Bo Kyung Kong, Eun Heui Choi, Young Seon Park, Woo Jin Lee
  • Patent number: 9963382
    Abstract: The present invention relates to a method for handling an ultra-thin glass for a display panel and, more specifically, the invention enables the ultra-thin glass to be easily attached to or detached from a carrier glass for supporting the ultra-thin glass before and after a surface treatment process for applying the ultra-thin glass to a display panel. To this end, the method for handling an ultra-thin glass for a display panel, according to the present invention, comprises: a bonding step for bonding an ultra-thin glass and a carrier glass for supporting the ultra-thin glass by means of a phase transition material; a surface treatment step for treating a surface of the ultra-thin glass; and a separation step for separating the ultra-thin glass from the carrier glass.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: May 8, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Jin Soo An, Bo Kyung Kong, Chang Moog Rim, Eun Heui Choi
  • Publication number: 20160274406
    Abstract: The present invention relates to a flexible substrate bonding method and, more particularly, to a bonding method for bonding a flexible substrate to a carrier substrate in order to facilitate handling of the flexible substrate. To this end, the present invention provides a flexible substrate bonding method comprising: a substrate preparation step for preparing a carrier substrate and a flexible substrate; and a bonding step for bonding the carrier substrate to the flexible substrate, which rotates by being wound around a rotation roll, while moving the carrier substrate by a transfer unit, wherein the bonding step includes bringing one edge of the flexible substrate into contact with the carrier substrate, and then gradually bonding the flexible substrate to the carrier substrate in a direction from one side to the other side.
    Type: Application
    Filed: November 18, 2014
    Publication date: September 22, 2016
    Applicant: Corning Precision Materials Co., Ltd.
    Inventors: Gyung Soo Kang, Bo Kyung Kong, Eun Heui Choi, Young Seon Park, Woo Jin Lee
  • Publication number: 20160159685
    Abstract: The present invention relates to a method for handling an ultra-thin glass for a display panel and, more specifically, the invention enables the ultra-thin glass to be easily attached to or detached from a carrier glass for supporting the ultra-thin glass before and after a surface treatment process for applying the ultra-thin glass to a display panel. To this end, the method for handling an ultra-thin glass for a display panel, according to the present invention, comprises: a bonding step for bonding an ultra-thin glass and a carrier glass for supporting the ultra-thin glass by means of a phase transition material; a surface treatment step for treating a surface of the ultra-thin glass; and a separation step for separating the ultra-thin glass from the carrier glass.
    Type: Application
    Filed: July 28, 2014
    Publication date: June 9, 2016
    Applicant: Corning Precision Materials Co., Ltd.
    Inventors: Jin Soo AN, Bo Kyung KONG, Chang Moog RIM, Eun Heui CHOI