Patents by Inventor Eun Hye NA

Eun Hye NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9966179
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chin Mo Kim, Jung Wook Seo, Eun Hye Na, Hak Kwan Kim, Hyung Jin Jeon, Sung Yong An
  • Patent number: 9928953
    Abstract: A coil component may include a core element, a coil conductor embedded in a surface of the core element, and a cover element bonded to the surface of the core element in which the coil conductor is embedded. Since the core element and the cover element are integrally formed, common failures, such as delamination or cracks, may be suppressed, and thereby product reliability may be improved.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Jin Jeon, Jung Wook Seo, Eun Hye Na
  • Publication number: 20160307687
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Chin Mo KIM, Jung Wook SEO, Eun Hye NA, Hak Kwan KIM, Hyung Jin JEON, Sung Yong AN
  • Publication number: 20160189852
    Abstract: A coil component may include a core element, a coil conductor embedded in a surface of the core element, and a cover element bonded to the surface of the core element in which the coil conductor is embedded. Since the core element and the cover element are integrally formed, common failures, such as delamination or cracks, may be suppressed, and thereby product reliability may be improved.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 30, 2016
    Inventors: Hyung Jin JEON, Jung Wook SEO, Eun Hye NA