Patents by Inventor Eun Je Hyun

Eun Je Hyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11119075
    Abstract: A gas sensor including a gas sensing device having a resonant frequency that varies with adsorbed chemicals, a frequency detector configured to detect the resonant frequency of the gas sensing device, a calibrator configured to generate current calibration data based on the resonant frequency of the gas sensing device which has been heated to a calibration temperature in a calibration mode, and a compensator configured to adjust an output value of the frequency detector based on the current calibration data in a sensing mode may be provided.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong-ho Park, Eun-je Hyun, Kwang-min Park, Min-chul Lee
  • Patent number: 11089242
    Abstract: An RGBW image sensor, a binning method in an image sensor, and a computer readable medium for performing the method are provided, and the binning method in an image sensor includes selecting one or more binning target pixels for each of a red pixel, a green pixel, a blue pixel, and a white pixel, constituting a pixel array of an RGBW image sensor with a uniform array pattern, generating binning pixel data for each of the red pixel, the green pixel, the blue pixel, and the white pixel, based on pieces of pixel data corresponding to the binning target pixel, and rearranging pixels, represented by the binning pixel data, to be equal to the entirety or a portion of the uniform array pattern and to be equally spaced apart from each other.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Ki Min, Moo Young Kim, Ji Hye Kim, Jong Min You, Kwang Hyun Lee, Joon Hyuk Im, Seong Yeong Jeong, Eun Je Hyun
  • Publication number: 20200295096
    Abstract: An RGBW image sensor, a binning method in an image sensor, and a computer readable medium for performing the method are provided, and the binning method in an image sensor includes selecting one or more binning target pixels for each of a red pixel, a green pixel, a blue pixel, and a white pixel, constituting a pixel array of an RGBW image sensor with a uniform array pattern, generating binning pixel data for each of the red pixel, the green pixel, the blue pixel, and the white pixel, based on pieces of pixel data corresponding to the binning target pixel, and rearranging pixels, represented by the binning pixel data, to be equal to the entirety or a portion of the uniform array pattern and to be equally spaced apart from each other.
    Type: Application
    Filed: November 14, 2019
    Publication date: September 17, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Ki MIN, Moo Young KIM, Ji Hye KIM, Jong Min YOU, Kwang Hyun LEE, Joon Hyuk IM, Seong Yeong JEONG, Eun Je HYUN
  • Publication number: 20200110060
    Abstract: A gas sensor including a gas sensing device having a resonant frequency that varies with adsorbed chemicals, a frequency detector configured to detect the resonant frequency of the gas sensing device, a calibrator configured to generate current calibration data based on the resonant frequency of the gas sensing device which has been heated to a calibration temperature in a calibration mode, and a compensator configured to adjust an output value of the frequency detector based on the current calibration data in a sensing mode may be provided.
    Type: Application
    Filed: May 16, 2019
    Publication date: April 9, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeong-ho Park, Eun-je HYUN, Kwang-min PARK, Min-chul LEE
  • Publication number: 20170067973
    Abstract: A coil assembly and a magnetic resonance imaging (MRI) apparatus including the same are disclosed. After completion of inspection or repair of the coil assembly, the coil assembly is easily coupled to the Mill apparatus. The coil assembly is configured to interact with a magnetic field generated from a MM apparatus and includes a first case configured to be bendable, a second case configured to be bendable and detachably coupled to the first case, and a printed circuit board substrate disposed between the first case and the second case.
    Type: Application
    Filed: September 3, 2016
    Publication date: March 9, 2017
    Inventors: Eun Je Hyun, Seul Gi Park, Ju Hyung Lee, Won Cheol Jeong