Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.

Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.

Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.

Abstract: In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.