Abstract: An embodiment provides a semiconductor element, which comprises: a substrate; and a semiconductor structure disposed on the substrate, wherein the semiconductor structure comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and a light absorption layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and the light absorption layer has a value of 1.2 to 1.5 as a ratio of a maximum outer periphery length of an upper surface thereof with respect to a maximum area of the upper surface thereof.

Abstract: A PCI-E signal transmission apparatus and an image forming apparatus using the same are provided. The PCI-E signal transmission apparatus includes a controller board, and at least one unit board which is connected to the controller board through a differential signal transmission cable, which uses a PCI-E protocol, to transceive data. Therefore, it is possible to transmit a signal using an inexpensive cable at a high speed.

Abstract: A light emitting device having an enhanced surface property and an electrical property is provided. The light emitting device includes a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode disposed on one side of the light emitting structure and electrically connected to the first semiconductor layer, a second electrode disposed on one side of the light emitting structure and electrically connected to the second semiconductor layer, and an ohmic contact including a first layer disposed between the second electrode and the second semiconductor layer and having aluminum (Al), a second layer including at least one MxAly alloy formed by a reaction with Al included in the first layer, and a third layer disposed on the second layer and having gold (Au) is provided.

Abstract: Embodiments provide a light emitting device including a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a sub-mount, first and second metal pads disposed on the sub-mount and electrically spaced apart from one another, a one first bump disposed between the first conductive semiconductor layer and the first metal pad and a second bump located between the second conductive semiconductor layer and the second metal pad. A plurality of active areas in which The first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.

Abstract: A light emitting device having an enhanced surface property and an electrical property is provided. The light emitting device includes a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode disposed on one side of the light emitting structure and electrically connected to the first semiconductor layer, a second electrode disposed on one side of the light emitting structure and electrically connected to the second semiconductor layer, and an ohmic contact including a first layer disposed between the second electrode and the second semiconductor layer and having aluminum (Al), a second layer including at least one MxAly alloy formed by a reaction with Al included in the first layer, and a third layer disposed on the second layer and having gold (Au) is provided.

Abstract: An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.

Abstract: Embodiments provide a light emitting device including a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a sub-mount, first and second metal pads disposed on the sub-mount and electrically spaced apart from one another, a one first bump disposed between the first conductive semiconductor layer and the first metal pad and a second bump located between the second conductive semiconductor layer and the second metal pad. A plurality of active areas in which The first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.

Abstract: An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.

Abstract: An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.

Abstract: An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.

Abstract: A PCI-E signal transmission apparatus and an image forming apparatus using the same are provided. The PCI-E signal transmission apparatus includes a controller board, and at least one unit board which is connected to the controller board through a differential signal transmission cable, which uses a PCI-E protocol, to transceive data. Therefore, it is possible to transmit a signal using an inexpensive cable at a high speed.

Abstract: An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.