Abstract: Provided are a device and method for synchronizing data between hubs in real time. The method includes verifying a session interworking environment, deriving session negotiation candidates, generating a session negotiation protocol message, transmitting a session negotiation request signal including the generated session negotiation protocol message to a second data hub, receiving a session negotiation settlement signal corresponding to the session negotiation request signal from the second data hub, generating a session module on the basis of the session negotiation settlement signal, and transmitting a session negotiation settlement signal to the second data hub.

Abstract: Provided are a device and method for synchronizing data between hubs in real time. The method includes verifying a session interworking environment, deriving session negotiation candidates, generating a session negotiation protocol message, transmitting a session negotiation request signal including the generated session negotiation protocol message to a second data hub, receiving a session negotiation settlement signal corresponding to the session negotiation request signal from the second data hub, generating a session module on the basis of the session negotiation settlement signal, and transmitting a session negotiation settlement signal to the second data hub.

Abstract: The present invention relates to a method of detecting multiple targets based on a single detection probe, and more particularly to a method of detecting multiple targets by amplifying each target with primers including an SNP-containing tag sequence, hybridizing the amplification products with a single detection probe capable of binding to the tag sequences and designed such that melting temperatures are different from each other, and analyzing melting curves. A method of detecting multiple targets according to the present invention enables the detection of multiple targets using a single probe, and thus is useful for detecting multiple targets because false positives are reduced and multiple targets are detectable with high sensitivity and at a rapid rate.

Abstract: The present invention relates to a method for analyzing the presence or absence of aneuploidy of a target chromosome with high sensitivity, and a composition for detecting chromosomal aneuploidy, and more particularly to a method of identifying chromosomal aneuploidy by amplifying a control nucleotide sequence, located on a chromosome not associated with chromosomal aneuploidy, and a target nucleotide sequence located on a chromosome associated with chromosomal aneuploidy, by using the same primer, and then hybridizing the amplification products with an assay probe that differs by one or two nucleotides from the control nucleotide sequence and with an elimination probe that comprises part or all of a sequence of the assay probe, which hybridizes with the target nucleotide sequence or the control nucleotide sequence, the elimination probe having a higher binding affinity for the amplification products than the assay probe, and analyzing melting curves of the hybridization products.

Abstract: A cloud service method to provide an integrated payment service may include providing a service provider with a website that provides a service provider interface; receiving an application key value corresponding to at least one online application store among application key values issued from a plurality of online application stores, and registering the issued application key value and information for interaction with an online application store, input from the service provider, through the website; registering an item for an application based on information for interaction with the registered online application store; and providing a terminal in which the application is installed with a single interface generated using a payment application programming interface (API) for providing an integrated payment service in response to a request for payment for at least one item among registered items from the application.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.

Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.

Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.

Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.