Abstract: The present invention relates to the system, method and program for the pharmacokinetic parameter prediction of peptide sequence by the mathematical model. The present invention is comprising the steps of acquiring a variety of peptide sequence having specific features by the experimental technique; acquiring, on the basis of the sequence, a variety of peptide sequences lacking the specific features; storing the acquired peptide sequences as each set respectively, followed by randomly extracting peptide sequences in the constant ratio to divide into a training set and a test set of mathematical model; allowing individual peptide sequence descriptor values and an activity value; training the set of training peptide by mathematical model; predicting pharmacokinetic parameter of the set of test peptide by the trained mathematical model; and validating the trained mathematical model.

Abstract: A method of forming a protection layer on a specimen for TEM inspection and a method of forming a specimen for TEM inspection are provided. The method of forming a protection layer on a specimen for TEM inspection generally comprises coating a wafer slice comprising an inspection point with a protection material and compressing the protection material to the wafer slice. The method of forming a specimen for TEM inspection generally comprises cutting a wafer slice comprising an inspection point from a wafer, forming a protection layer on the wafer slice, forming a first preliminary specimen by cutting the wafer slice, forming a second preliminary specimen by grinding the first preliminary specimen, and forming a TEM specimen by etching portions of the second preliminary specimen.

Abstract: A method of forming a protection layer on a specimen for TEM inspection and a method of forming a specimen for TEM inspection are provided. The method of forming a protection layer on a specimen for TEM inspection generally comprises coating a wafer slice comprising an inspection point with a protection material and compressing the protection material to the wafer slice. The method of forming a specimen for TEM inspection generally comprises cutting a wafer slice comprising an inspection point from a wafer, forming a protection layer on the wafer slice, forming a first preliminary specimen by cutting the wafer slice, forming a second preliminary specimen by grinding the first preliminary specimen, and forming a TEM specimen by etching portions of the second preliminary specimen.