Patents by Inventor Eun-Kyun Chung

Eun-Kyun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140063762
    Abstract: A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 ?m and 3 ?m, II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    Inventors: Jae-Sung RYU, Eun-Kyun CHUNG, Yong-Deok TARK
  • Patent number: 7766212
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 3, 2010
    Assignee: W.C. Heraeus GmbH
    Inventors: Dong-Ik Yang, Eun-Kyun Chung, Joong-Geun Shin, Nam-Kwon Cho
  • Publication number: 20090072063
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 19, 2009
    Applicant: W.C. HERAEUS GMBH
    Inventors: Dong-Ik YANG, Eun-Kyun CHUNG, Joong-Geun SHIN, Nam-Kwon CHO