Patents by Inventor Eun-lai Lee

Eun-lai Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11048460
    Abstract: A display module and a display apparatus having the same are provided. The display module including a circuit board, a plurality of light emitting device packages disposed on the circuit board and electrically coupled to the circuit board, and a coating unit coated with coating solution containing a light diffusion agent covers the plurality of light emitting device packages and fills in a gap between the plurality of light emitting device packages, wherein the coating unit further includes at least one first light diffusion part that is curvedly formed on a surface of the coating unit onto which light emitted from the light emitting device packages is incident.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-sang Kim, Jee-su Park, Eun-lai Lee, Jae-min Lee, Tae-hyeun Ha, Suk Hyun, Cheoul-young Kim, Seung-Jae Lee
  • Publication number: 20190361660
    Abstract: A display module and a display apparatus having the same are provided. The display module including a circuit board, a plurality of light emitting device packages disposed on the circuit board and electrically coupled to the circuit board, and a coating unit coated with coating solution containing a light diffusion agent covers the plurality of light emitting device packages and fills in a gap between the plurality of light emitting device packages, wherein the coating unit further includes at least one first light diffusion part that is curvedly formed on a surface of the coating unit onto which light emitted from the light emitting device packages is incident.
    Type: Application
    Filed: August 13, 2019
    Publication date: November 28, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-sang KIM, Jee-su PARK, Eun-lai LEE, Jae-min LEE, Tae-hyeun HA, Suk HYUN, Cheoul-young KIM, Seung-Jae LEE
  • Patent number: 10423380
    Abstract: A display module and a display apparatus having the same are provided. The display module including a circuit board, a plurality of light emitting device packages disposed on the circuit board and electrically coupled to the circuit board, and a coating unit coated with coating solution containing a light diffusion agent covers the plurality of light emitting device packages and fills in a gap between the plurality of light emitting device packages, wherein the coating unit further includes at least one first light diffusion part that is curvedly formed on a surface of the coating unit onto which light emitted from the light emitting device packages is incident.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: September 24, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-sang Kim, Jee-su Park, Eun-lai Lee, Jae-min Lee, Tae-hyeun Ha, Suk Hyun, Cheoul-young Kim, Seung-jae Lee
  • Publication number: 20160350053
    Abstract: A display module and a display apparatus having the same are provided. The display module including a circuit board, a plurality of light emitting device packages disposed on the circuit board and electrically coupled to the circuit board, and a coating unit coated with coating solution containing a light diffusion agent covers the plurality of light emitting device packages and fills in a gap between the plurality of light emitting device packages, wherein the coating unit further includes at least one first light diffusion part that is curvedly formed on a surface of the coating unit onto which light emitted from the light emitting device packages is incident.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-sang KIM, Jee-su PARK, Eun-lai LEE, Jae-min LEE, Tae-hyeun HA, Suk HYUN, Cheoul-young KIM, Seung-jae LEE
  • Publication number: 20050283794
    Abstract: Disclosed are a set-top box configured for preventing hacking through microelectronic devices or wirings on a printed circuit board therein, and a method of depositing a high-molecular material therefor. The prevention of hacking within a set-top box is obtained by depositing and curing a liquid high-molecular material, which includes epoxy and a curing agent, on an area(s) of microelectronic devices or on an area(s) of wirings connecting the microelectronic devices through which the interior of the set-top box may be hacked. In addition, the liquid high-molecular material is deposited in a frame manufactured to a size and shape desired for deposition around the area(s) to deposit the high-molecular material in uniform dimensions and height and thereby reduce manufacturing cost.
    Type: Application
    Filed: May 16, 2005
    Publication date: December 22, 2005
    Inventor: Eun-lai Lee