Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Abstract: A method and apparatus for providing a traffic information service using a mobile communication terminal are provided. A method of a mobile communication terminal for a traffic information service is provided. The method includes constructing a cluster with at least one neighboring Mobile Station (MS), receiving traffic information from the at least one neighboring MS comprised in the cluster, measuring traffic information using location information of the MS, and transmitting a traffic information message comprising the collected traffic information to a traffic information provision server.

Abstract: A method and apparatus for providing a traffic information service using a mobile communication terminal are provided. A method of a mobile communication terminal for a traffic information service is provided. The method includes constructing a cluster with at least one neighboring Mobile Station (MS), receiving traffic information from the at least one neighboring MS comprised in the cluster, measuring traffic information using location information of the MS, and transmitting a traffic information message comprising the collected traffic information to a traffic information provision server.

Abstract: Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.

Abstract: A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semiconductor chips among the semiconductor chips of a predetermined number of lots that are first time tested are collectively retested. First test data regarding the semiconductor chips may be classified and stored for each respective lot. Retest data regarding the semiconductor chips may be classified and stored for each respective lot. Test data regarding the semiconductor chips may be classified and stored into first test data and retest data for each respective lot.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.