Patents by Inventor Eunseon Lee

Eunseon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for forming silica layer, method for manufacturing silica layer and silica layer
    Patent number: 10106687
    Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Junyoung Jang, Huichan Yun, Woo Han Kim, Kunbae Noh, Eunseon Lee, Taeksoo Kwak, Jingyo Kim, Haneul Kim, Yoong Hee Na, Jin-Hee Bae, Jinwoo Seo, Byeonggyu Hwang
  • COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER AND SILICA LAYER
    Publication number: 20170029624
    Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.
    Type: Application
    Filed: March 4, 2016
    Publication date: February 2, 2017
    Inventors: Junyoung Jang, Huichan Yun, Woo Han Kim, Kunbae Noh, Eunseon Lee, Taeksoo Kwak, Jingyo Kim, Haneul Kim, Yoong Hee Na, Jin-Hee Bae, Jinwoo Seo, Byeonggyu Hwang
  • Light emitting device module
    Patent number: 9062857
    Abstract: A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: June 23, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yontae Moon, Eunseon Lee
  • LIGHT EMITTING DEVICE MODULE
    Publication number: 20120002427
    Abstract: A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position.
    Type: Application
    Filed: April 20, 2011
    Publication date: January 5, 2012
    Inventors: Yontae MOON, Eunseon Lee