Abstract: A liquid silicone resin composition is provided. The liquid silicone resin composition comprises (A) a polysiloxane, (B) a polyether alcohol compound, and optionally (C) an aminosilicon compound. The polysiloxane (A) comprises an MQ resin, which is dispersed in and optionally functionalized with the polyether alcohol compound (B), and which may also optionally have amino functionality. The liquid silicone resin composition comprises a tunable viscosity, which may range at 25° C. from 100 to 800,000 cps. A method of preparing the liquid silicone resin is also provided. The method comprises combining together a solid silicone resin and the polyether alcohol compound (B) to give a mixture comprising the polysiloxane (A) and the polyether alcohol compound (B), and liquefying the mixture, thereby preparing the liquid silicone resin composition. The method may optionally include the aminosilicon compound (C).

Abstract: A composition contains a mixture of silyl hydride, epoxide and a Bridged Frustrated Lewis Pair.

Abstract: Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use.

Abstract: A composition for forming a silicone elastomer is disclosed. The composition comprises: A) a linear organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) a linear organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) at least one cross-linker; and D) a hydrosilylation catalyst. The cross-linker C) is selected from the group consisting of: C1) an organopolysiloxane having at least three silicon-bonded ethylenically unsaturated groups per molecule; and C2) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule. At least one of the silicon-bonded ethylenically unsaturated groups of component C1) has a lower reactivity relative to the silicon-bonded ethylenically unsaturated groups of component A). Moreover, at least one of the silicon-bonded hydrogen atoms of component C2) has a lower reactivity relative to the silicon-bonded hydrogen atoms of component B).

Abstract: A composition contains a mixture of silyl hydride, epoxide and a Bridged Frustrated Lewis Pair.

Abstract: A composition contains a mixture of silyl hydride, a silanol and/or a silyl ether, and a Bridged Frustrated Lewis Pair.

Abstract: A composition contains an alpha-beta unsaturated ester, a silyl hydride, and a Bridged Frustrated Lewis Pair.

Abstract: A composition contains a mixture of silyl hydride, a siloxane and a Bridged Frustrated Lewis Pair and can be thermally triggered to cure.

Abstract: An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): YaR1bSiO(4-a-b)/2 wherein R1 is an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0<a?2, 0<b?3, and a?b. The organosilicon compound is compatible with organopolysiloxanes and is useful as a photo-initiator for various types of photo-curable compositions.

Abstract: A photo-curable organopolysiloxane composition is provided. The photo-curable organopolysiloxane composition comprises: (A) 100 parts by mass of a photo-curable organopolysiloxane; and (B) about 0.01 to about 5.0 parts by mass of an organosilicon compound having at least one photo-active organic group and having at most about 200 silicon atoms per molecule, wherein the organosilicon compound is activated when it is exposed to light of a wavelength of from 300 to 420 nm. The photo-curable organopolysiloxane composition exhibits good storage ability and can be cured by exposing light of a wavelength of from 300 to 420 nm, and can form a cured product exhibiting good transparency.

Abstract: A composition for forming a silicone elastomer is disclosed. The composition comprises: A) a linear organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) a linear organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) at least one cross-linker; and D) a hydrosilylation catalyst. The cross-linker C) is selected from the group consisting of: C1) an organopolysiloxane having at least three silicon-bonded ethylenically unsaturated groups per molecule; and C2) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule. At least one of the silicon-bonded ethylenically unsaturated groups of component C1) has a lower reactivity relative to the silicon-bonded ethylenically unsaturated groups of component A). Moreover, at least one of the silicon-bonded hydrogen atoms of component C2) has a lower reactivity relative to the silicon-bonded hydrogen atoms of component B).