Abstract: The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.

Abstract: The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.

Abstract: Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.

Abstract: The present invention relates to a method of manufacturing a metal clad laminate for printed circuit board, characterized by direct adhesion of a conductive metal foil without use of a thermosetting resin having low melting points, an adherent film or an adhesive. The method includes forming fine protrusions on at least one surface of a fluorine-based resin insulation layer, roughening one surface of a conductive metal foil, laminating the fluorine-based resin insulation layer having fine protrusions on the roughened metal foil so that the roughened surface of the metal foil and the protrusion-formed surface of the insulation layer face each other to form a laminated body, and compressing the laminated body under vacuum, pressure and heat.

Abstract: A method for fabricating a nano-sized diamond whisker includes the steps of depositing a diamond film on a substrate, forming a nano-sized mask pattern on the deposited diamond film, and etching the diamond film by using the nano-sized pattern as an etching mask. The nano-sized diamond whisker can be used as a new field emission cold cathode device, thereby advancing a practical use of a field emission device having high performance, and can also be applied to various fields such as a new composite material and a mechanical device.

Abstract: A method for fabricating a nano-sized diamond whisker includes the steps of depositing a diamond film on a substrate, forming a nano-sized mask pattern on the deposited diamond film, and etching the diamond film by using the nano-sized pattern as an etching mask. The nano-sized diamond whisker can be used as a new field emission cold cathode device, thereby advancing a practical use of a field emission device having high performance, and can also be applied to various fields such as a new composite material and a mechanical device.