Patents by Inventor Eun-soo Hyun

Eun-soo Hyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
    Patent number: 7964938
    Abstract: The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interference (EMI)-shielding function, a manufacturing method thereof and a jig for use in a plasma sputtering, in which a nickel alloy is coated on the surface of a semiconductor package by a sputtering method so as to shield electromagnetic interference (EMI) generated from the semiconductor package.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: June 21, 2011
    Inventors: Jum-chae Yoon, Eun-soo Hyun, Seung-ki Kim
  • Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
    Publication number: 20090294930
    Abstract: The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interference (EMI)-shielding function, a manufacturing method thereof and a jig for use in a plasma sputtering, in which a nickel alloy is coated on the surface of a semiconductor package by a sputtering method so as to shield electromagnetic interference (EMI) generated from the semiconductor package.
    Type: Application
    Filed: May 29, 2009
    Publication date: December 3, 2009
    Inventors: Jum-chae YOON, Eun-soo Hyun, Seung-ki Kim