Patents by Inventor Eun Su JEON

Eun Su JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL RHIZOPUS OLIGOSPORUS STRAIN AND ANTIMICROBIAL COMPOSITION INCLUDING THE SAME
    Publication number: 20240117294
    Abstract: The present application relates to a Rhizopus oligosporus CJCC02-20 strain deposited with Accession No. KCCM12893P and application thereof.
    Type: Application
    Filed: March 29, 2021
    Publication date: April 11, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Hyelim KWON, Hyungseok RYU, Hee-Su KWON, Eun Jung JEON, Jiyoung OH
  • SYSTEMS AND METHODS FOR GENERATING ROLL MAP AND MANUFACTURING BATTERY USING ROLL MAP
    Publication number: 20240097218
    Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Min Kyu Sim, Jong Seok Park, Min Su Kim, Jae Hwan Lee, Ki Deok Han, Eun Ji Jo, Su Wan Park, Gi Yeong Jeon, June Hee Kim, Wi Dae Park, Dong Min Seo, Seol Hee Kim, Dong Yeop Lee, Jun Hyo Su, Byoung Eun Han, Seung Huh
  • Lamination system
    Patent number: 11794461
    Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 24, 2023
    Assignee: STI CO., LTD.
    Inventors: Eun Su Jeon, Kyu Yong Han, Sang Pil Park, Jae Hwan Kim
  • ADHESIVE LAYER FORMING APPARATUS AND DISPLAY DEVICE MANUFACTURING SYSTEM INCLUDING THE SAME
    Publication number: 20230029555
    Abstract: Disclosed are an adhesive layer forming apparatus and a display device manufacturing system including the same. The adhesive layer forming apparatus includes a first support chuck configured to move a first panel along a panel movement path in a first direction, a second support chuck provided side by side with the first support chuck in a second direction orthogonal to the first direction and configured to move a second panel along a panel movement path, and a first gantry configured to move a first head, which faces the first support chuck and the second support chuck, in the second direction on the first support chuck and the second support chuck and forms an adhesive layer on any one of the first panel and the second panel by jetting.
    Type: Application
    Filed: July 11, 2022
    Publication date: February 2, 2023
    Applicant: STI CO., LTD.
    Inventors: Dae Il YOU, Eun Su JEON, Sang Pil PARK, Kyu Yong HAN
  • LAMINATION SYSTEM
    Publication number: 20220339922
    Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.
    Type: Application
    Filed: February 18, 2022
    Publication date: October 27, 2022
    Applicant: STI CO., LTD.
    Inventors: Eun Su JEON, Kyu Yong HAN, Sang Pil PARK, Jae Hwan KIM