Patents by Inventor Eun Su Ko

Eun Su Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer manufacturing method, epitaxial wafer manufacturing method, and wafer and epitaxial wafer manufactured thereby
    Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • WAFER MANUFACTURING METHOD, EPITAXIAL WAFER MANUFACTURING METHOD, AND WAFER AND EPITAXIAL WAFER MANUFACTURED THEREBY
    Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Composition for treating wound comprising gypenoside LXXV
    Patent number: 10363262
    Abstract: The present invention relates to a composition for wound healing or skin regeneration comprising gypenoside 75 (gypenoside LXXV) as an active ingredient.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 30, 2019
    Assignee: INTELLIGENT SYNTHETIC BIOLOGY CENTER
    Inventors: Sun-Chang Kim, Sungjoo Park, Eun Su Ko