Abstract: The present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. The protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.

Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

Abstract: A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.