Patents by Inventor Eun Su KWON

Eun Su KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250126705
    Abstract: The present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. The protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.
    Type: Application
    Filed: May 30, 2024
    Publication date: April 17, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Eun Su KWON
  • Patent number: 12262467
    Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: March 25, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong Min, Eun Su Kwon
  • Publication number: 20240057251
    Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
    Type: Application
    Filed: February 24, 2023
    Publication date: February 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong Min, Eun Su Kwon
  • Publication number: 20240032208
    Abstract: A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.
    Type: Application
    Filed: March 1, 2023
    Publication date: January 25, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong MIN, Eun Su KWON