Abstract: An image sensor includes: a pixel including a boosting capacitor with one electrode connected to a first node to which a charge generated from a photoelectric element is transmitted, and outputting a pixel voltage based on the first node; a row driver outputting a reset-signal that resets the first node, a boosting control-signal applied to the other electrode, and a transmission-signal transmitting the charge to the first node; a read-out-circuit receiving the pixel voltage as a first-signal before the transmission-signal is output to the pixel, and receiving the pixel voltage as a second-signal after the transmission-signal is output to the pixel. A controller controlling the row driver to change the boosting control-signal from a first-level to a second-level lower than the first-level after changing the reset-signal from an enable to a disable, and controlling the read-out-circuit to receive the first-signal and the second-signal during which the boosting control-signal is at the second-level.

Abstract: An image sensor is provided. The image sensor includes: a pixel array of pixels arranged in a row and column directions. A first pixel provided in a first row of the pixel array includes a first sub-pixel connected with a first metal line, a second sub-pixel connected with a second metal line, a third sub-pixel connected with a third metal line, and a fourth sub-pixel connected with a fourth metal line. When a read-out operation is performed on the first pixel, signals applied to the first through fourth metal lines are sequentially enabled. Based on the applied signals, at least a part of charges accumulated in the first through fourth sub-pixels is diffused to a first floating diffusion node. The first sub-pixel and the third sub-pixel are adjacent in the column direction, and the first sub-pixel and the second sub-pixel are adjacent in the row direction.

Abstract: The present disclosure relates to an image sensor, and the image sensor of the present disclosure may include a plurality of pixels, each of which includes a photovoltaic device configured to convert incident light into charge, and a capacitor configured to store the charge, the capacitor of each of the plurality of pixels may include a first electrode and a second electrode that overlap each other, and a dielectric layer that is between the first electrode and the second electrode, the plurality of pixels may include a first pixel and a second pixel adjacent to each other, and the second electrode of the first pixel and the second electrode of the second pixel may be integral with each other.

Abstract: An image sensor includes a pixel including a first floating diffusion and a second floating diffusion, generating a first pixel signal based on a quantity of charge of the first floating diffusion, and generating a second pixel signal based on the quantity of charge of the first floating diffusion and a quantity of charge of the second floating diffusion; a column line connected to the pixel and transmitting the first pixel signal or the second pixel signal; and a readout circuit connected to the column line and generating an image signal based on a plurality of comparison results including a first comparison result obtained by comparing the first pixel signal with a first reference signal, a second comparison result obtained by comparing the second pixel signal with a first reference signal, and a third comparison result obtained by comparing the second pixel signal with a second reference signal.

Abstract: An image sensor is provided. The image sensor includes: a pixel array including a plurality of pixels arranged along rows and columns; and a row driver which drives the plurality of pixels for each of the rows, wherein each of the plurality of pixels includes a plurality of sub-pixels, each of the plurality of sub-pixels includes a plurality of photoelectric conversion elements sharing a floating diffusion area with each other, and a micro lens disposed to overlap the plurality of photoelectric conversion elements, a readout area is defined on the pixel array in accordance with a preset readout mode, and the row driver generates a drive signal for reading out signals provided from a photoelectric conversion element included in the readout area from among the plurality of photoelectric conversion elements, and provides the drive signal to the pixel array.

Abstract: An image sensor includes a first pixel group, a second pixel group arranged in a same column and row as the first pixel group, a first analog-to-digital converter and a second analog-to-digital converter corresponding to the first pixel group and the second pixel group, respectively and configured to process pixel signals output from the first pixel group and the second pixel group, and a switching circuit configured to selectively transmit a first pixel signal output from the first pixel group and a second pixel signal output from the second pixel group to the first analog-to-digital converter or the second analog-to-digital converter. While the first analog-to-digital converter is connected to the first pixel group to process the first pixel signal, the second analog-to-digital converter is connected to the second pixel group to process the second pixel signal. Accordingly, auto-focus information may be more effectively obtained.

Abstract: An example embodiment provides an image sensor including: a pixel array including a first floating diffusion and a second floating diffusion, the first floating diffusion and the second floating diffusion configured to store charges generated by a first phase detecting pixel and a second phase detecting pixel adjacent to each other in a first direction and covered with one micro lens, and the pixel array is configured to output a first signal based on a charge that is generated by the first phase detecting pixel to be accumulated in the first floating diffusion and the second floating diffusion; and a row driver configured to apply a boosting control signal to the second floating diffusion to transfer charges stored in the second floating diffusion to the first floating diffusion, after the pixel array outputs the first signal.

Abstract: An image sensor includes: a pixel including a boosting capacitor with one electrode connected to a first node to which a charge generated from a photoelectric element is transmitted, and outputting a pixel voltage based on the first node; a row driver outputting a reset-signal that resets the first node, a boosting control-signal applied to the other electrode, and a transmission-signal transmitting the charge to the first node; a read-out-circuit receiving the pixel voltage as a first-signal before the transmission-signal is output to the pixel, and receiving the pixel voltage as a second-signal after the transmission-signal is output to the pixel. A controller controlling the row driver to change the boosting control-signal from a first-level to a second-level lower than the first-level after changing the reset-signal from an enable to a disable, and controlling the read-out-circuit to receive the first-signal and the second-signal during which the boosting control-signal is at the second-level.

Abstract: Disclosed is an image sensor including a plurality of first pixels arranged in a first row and configured to generate first charges in response to a first exposure and a plurality of second pixels arranged in a second row different from the first row and configured to generate second charges in response to a second exposure. At least one pixel of the plurality of first pixels includes a photo diode, a first floating diffusion, a first transfer transistor, a gate electrode of the first transfer transistor partially overlapping the first floating diffusion area when viewed in a horizontal direction, a second floating diffusion area spaced apart from the first floating diffusion area, one end of the second floating diffusion area being connected to a gate of a drive transistor, and a second transfer transistor that electrically connects the first floating diffusion area to the second floating diffusion area.

Abstract: A method of fabricating an image sensor includes providing a semiconductor substrate, forming a trench in the semiconductor substrate to define pixel regions, doping the trench with dopants of a first conductivity type, doping the trench with dopants of a second conductivity type after doping the trench with dopants of the first conductivity type, forming an insulating liner pattern in the trench after the doping of the trench, performing a first thermal treatment process on the semiconductor substrate after forming the insulating liner pattern, and forming a filling pattern filling an inner space of the trench after performing the first thermal treatment process. A diffusion coefficient of the dopants of the first conductivity type is greater than a diffusion coefficient of the dopants of the second conductivity type. The first thermal treatment process diffuses the dopants of the first and second conductivity types into the semiconductor substrate simultaneously.

Abstract: An image sensor includes; a pixel array including at an auto focusing (AF) pixel and an AF adjacent pixel, which is adjacent to the AF pixel and is configured to share a floating diffusion region with the AF pixel; and a row driver configured to control the pixel array, wherein a first end of a photo diode included in the AF pixel is connected to a first transmission transistor, and a second end of the photo diode included in the AF pixel is connected to a ground through a first signal line, and wherein a first end of a photo diode included in the AF adjacent pixel is connected to a second transmission transistor, and a second end of the photo diode included in the AF adjacent pixel is connected to the row driver through a second signal line.

Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.

Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.

Abstract: Disclosed is an image sensor which includes a photo diode that generates charges based on an incident light, a first floating diffusion region that stores the charges generated by the photo diode, a first boosting capacitor that is connected with the first floating diffusion region, a second floating diffusion region that is disposed to be spaced from the first floating diffusion region and includes a first end connected with a gate of a drive transistor, a transfer transistor that electrically connects the photo diode with the first floating diffusion region in response to a transfer signal, and a floating diffusion region transistor that electrically connects the first floating diffusion region with the second floating diffusion region in response to a floating control signal.

Abstract: An image sensor is provided. The image sensor includes: a pixel array including a plurality of pixels arranged along rows and columns; and a row driver which drives the plurality of pixels for each of the rows, wherein each of the plurality of pixels includes a plurality of sub-pixels, each of the plurality of sub-pixels includes a plurality of photoelectric conversion elements sharing a floating diffusion area with each other, and a micro lens disposed to overlap the plurality of photoelectric conversion elements, a readout area is defined on the pixel array in accordance with a preset readout mode, and the row driver generates a drive signal for reading out signals provided from a photoelectric conversion element included in the readout area from among the plurality of photoelectric conversion elements, and provides the drive signal to the pixel array.

Abstract: An image sensor includes a pixel array including a plurality of unit pixels arranged along a plurality of rows and a plurality of columns. Each of the unit pixels includes a photoelectric conversion element generating and accumulating photocharges, a charge detection node receiving the photocharges accumulated in the photoelectric conversion element, a readout circuit converting the photocharges accumulated in and output from the charge detection node into an electrical pixel signal, the readout circuit outputting the electrical pixel signal, a capacitive element, and a switching element controlling connection between the charge detection node and the capacitive element. Each of the rows of the pixel array includes first pixels connected to a first conversion gain control line and second pixels connected to a second conversion gain control line.

Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.

Abstract: An image sensor is provided. The image sensor includes: a pixel array of pixels arranged in a row and column directions. A first pixel provided in a first row of the pixel array includes a first sub-pixel connected with a first metal line, a second sub-pixel connected with a second metal line, a third sub-pixel connected with a third metal line, and a fourth sub-pixel connected with a fourth metal line. When a read-out operation is performed on the first pixel, signals applied to the first through fourth metal lines are sequentially enabled. Based on the applied signals, at least a part of charges accumulated in the first through fourth sub-pixels is diffused to a first floating diffusion node.

Abstract: An image sensor includes a semiconductor substrate having a first surface and a second surface with a pixel region having photoelectric conversion regions, a gate electrode disposed on the pixel region and adjacent to the first surface, a first isolation structure extending from the first surface toward the second surface, the first isolation structure comprising a first pixel isolation pattern enclosing the pixel region, and a first inner isolation pattern spaced apart from the first pixel isolation pattern and positioned between the photoelectric conversion regions, and a second isolation structure extending from the second surface toward the first surface with a top surface vertically spaced apart from at least a portion of a bottom surface of the first isolation structure. The bottom surface of the first isolation structure is closer to the second surface of the semiconductor substrate than to the first surface thereof.

Abstract: An image sensor is provided. The image sensor includes: a pixel array including a plurality of pixels arranged along rows and columns; and a row driver which drives the plurality of pixels for each of the rows, wherein each of the plurality of pixels includes a plurality of sub-pixels, each of the plurality of sub-pixels includes a plurality of photoelectric conversion elements sharing a floating diffusion area with each other, and a micro lens disposed to overlap the plurality of photoelectric conversion elements, a readout area is defined on the pixel array in accordance with a preset readout mode, and the row driver generates a drive signal for reading out signals provided from a photoelectric conversion element included in the readout area from among the plurality of photoelectric conversion elements, and provides the drive signal to the pixel array.