Patents by Inventor Eun Sun Park

Eun Sun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147620
    Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Youn Gyu HAN, Jin Oh PARK, Yong Wan JI, Yong Duk LEE, Eun Sun KIM
  • Publication number: 20240132571
    Abstract: The present invention relates to a composition for preventing or treating a bone disease, obesity or an obesity-mediated metabolic disease, cancer, or cancer metastasis, and a method of screening a drug for treating the diseases, which includes an inhibitor of transmembrane 4 L six family member 19 (TM4SF19) expression or activity.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 25, 2024
    Applicant: MedPacto Inc.
    Inventors: Seong Jin KIM, Su Jin PARK, Jin Sun HEO, Eun Ji HONG, Hae In AN, Min Woo KIM
  • Publication number: 20240116920
    Abstract: Provided is a novel JAK-specific inhibitor compound and a method for preparing the same. The compound of the provided can exhibit therapeutic effects on a variety of diseases, for example, inflammatory diseases, autoimmune diseases, myeloproliferative diseases, and human cancers due to its ability to regulate signal transduction at the level of JAK kinases. In particular, due to its high selectivity for JAK1, the compound of the provided can exhibit better therapeutic effects on inflammatory diseases and autoimmune diseases at a low dose and with fewer side effects and can be expected to be effective in preventing and treating liver fibrosis.
    Type: Application
    Filed: November 29, 2021
    Publication date: April 11, 2024
    Inventors: Soo Sung KANG, Eun Sun PARK, Eun Hee PARK, Sun Joo LEE, Seung Hee HAN
  • Publication number: 20240107373
    Abstract: Provided is a communication method and an electronic device performing the communication method. The communication method includes establishing a wireless connection for transmission of data, generating a medium access control (MAC) frame including a header formed only of a frame control field based on a type of the data, and transmitting the MAC frame including the data.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 28, 2024
    Inventors: Jae Sun CHA, Tae Joon PARK, Eun-Hee KIM, Kyeseon LEE
  • Publication number: 20240092913
    Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 21, 2024
    Applicant: HANALL BIOPHARMA CO., LTD.
    Inventors: Sung Wuk KIM, Seung Kook PARK, Jae Kap JEONG, Hyea Kyung AHN, Min Sun KIM, Eun Sun KIM, Hae-Young YONG, Dongok SHIN, Yeon Jung SONG, Tae Hyoung YOO
  • Publication number: 20240091730
    Abstract: The present invention relates to the stabilization of an effective ingredient by using a mineral material. In the present invention, the effective ingredient can be stably supported using the mineral material, and a microcapsule obtained by the manufacturing method according to the present invention, when discharged to nature, causes no environmental problems due to encapsulation ingredients thereof being the same as soil ingredients, and thus can avoid micro-plastic issues.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 21, 2024
    Applicants: LG HOUSEHOLD & HEALTH CARE LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Jun Seok YEOM, Eun Chul CHO, Ji Won LIM, Hyo Jin BONG, Seon A JEONG, No Jin PARK, Woo Sun SHIM
  • Patent number: 11930526
    Abstract: Disclosed are methods and apparatuses for transmitting data using a random access procedure in a communication system. An operation method of a terminal in a communication system includes transmitting a first MsgA including an RA preamble #i and a payload to a base station; receiving, from the base station, a MsgB including information indicating that an RA preamble #k is reserved; and transmitting a second MsgA including the RA preamble #k and data to the base station in a preamble reservation period associated with the RA preamble #k.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 12, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ok Sun Park, Seok Ki Kim, Gi Yoon Park, Eun Jeong Shin, Jae Sheung Shin, Jin Ho Choi
  • Patent number: 11915880
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun Chun, Hyoung Uk Kim, Jae Sung Park, Hyeg Soon An, Ku Tak Lee, Eun Ha Jang
  • Publication number: 20220220109
    Abstract: The present invention relates to a JAK inhibitor compound and a pharmaceutical composition including the same. More specifically, the present invention relates to a compound of Formula I or a pharmaceutically acceptable salt thereof and a pharmaceutical composition including the same. The structure of the compound of Formula I is described in the specification. The compound of the present invention can exhibit therapeutic effects on a variety of diseases, for example, inflammatory diseases, autoimmune diseases, myeloproliferative diseases, and human cancers due to its ability to regulate signal transduction at the level of JAK kinases.
    Type: Application
    Filed: May 27, 2020
    Publication date: July 14, 2022
    Inventors: Soosung KANG, Eun Sun PARK, Eun Hee PARK, Seung Hee HAN
  • Publication number: 20220053805
    Abstract: The present invention relates to a dried seaweed snack and a method for preparing the same.
    Type: Application
    Filed: September 18, 2019
    Publication date: February 24, 2022
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Eun Sun PARK, Ho Min MYUNG, Seung Eun PARK, Na Ri SHIN, Da Woon JEONG
  • Publication number: 20220007675
    Abstract: A cone-shaped edible container according to the present invention comprises: an edible outer layer; an edible inner layer; a first edible adhesive layer disposed between the outer layer and the inner layer to bond the outer layer and the inner layer together; and a second adhesive layer for maintaining the outer layer and the inner layer to be in the shape of a cone, wherein at least some regions of the edible container have a first cross-section structure in which the inner layer, the first adhesive layer, and the outer layer are sequentially laminated in a direction from the inside toward the outside, and have a second cross-section structure in which the inner layer, the first adhesive layer, the outer layer, the second adhesive layer, the inner layer, the first adhesive layer, and the outer layer are sequentially laminated in the direction from the inside toward the outside.
    Type: Application
    Filed: August 29, 2019
    Publication date: January 13, 2022
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Eun Sun PARK, Ho Min MYUNG, Seung Eun PARK, Na Ri SHIN, Da Woon JEONG
  • Publication number: 20220002047
    Abstract: A cone-shaped edible container according to the present invention comprises: an edible outer shell, an edible inner shell, and an edible first adhesive layer provided between the outer shell and the inner shell to adhere the outer shell and the inner shell to each other. The outer shell and the inner shell are rolled into a cone shape in a state of being adhered to each other so as to have a basic structure of a cone shape. The outer shell forms the outermost side of the basic structure, and the inner shell has a stronger rigidity than the outer shell. Thus, assuming a cone-shaped structure implemented only by the outer shell, even if an external force of a magnitude capable of breaking the assumed structure is applied to the basic structure, the basic structure is maintained.
    Type: Application
    Filed: August 29, 2019
    Publication date: January 6, 2022
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Eun Sun PARK, Ho Min MYUNG, Seung Eun PARK, Na Ri SHIN, Da Woon JEONG
  • Patent number: 11087972
    Abstract: Provided are a cleaning device and a method for driving the cleaning device which cleans a wafer after chemical mechanical polishing. The cleaning device includes a cleaning modules and a running beam, the running beam including a first blade and a second blade to insert or remove the wafer with respect to one of the cleaning modules in a second direction, the first blade and the second blade being fixed to the running beam and movable in the second direction, and the cleaning modules including an input module, a megasonic module, a first brush module, a second brush module and a drying module. The driving method includes performing an operation of inserting or removing the wafer in the second direction using the first blade in a first area; and performing an operation of inserting or removing the wafer in the second direction using the second blade in a second area.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Joon Park, Jin Yong Kim, Bong Ki Park, Eun Sun Park, Jae Hyeon Seo, Young Chul Lee
  • Patent number: D890469
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 21, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park
  • Patent number: D890470
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 21, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park
  • Patent number: D890535
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 21, 2020
    Assignee: SUNG JOO D&D, INC.
    Inventors: Sung Joo Kim, Eun Sun Park
  • Patent number: D891028
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 28, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park
  • Patent number: D891029
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 28, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park
  • Patent number: D891030
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: July 28, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park
  • Patent number: D891727
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: August 4, 2020
    Assignee: CJ CheilJedang Corporation
    Inventors: Eun Sun Park, Seung Eun Park, Na Ri Shin, Hye Jin Yim, Ki Hwang Park