Patents by Inventor Eunsun Youm

Eunsun Youm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of fabricating three-dimensional semiconductor device
    Patent number: 8569182
    Abstract: A method of fabricating a three-dimensional semiconductor device includes forming a stacked structure, and the stacked structure includes a first layer, a second layer, a third layer, and a fourth layer sequentially stacked on a substrate. The method also includes forming a sacrificial spacer on a sidewall of the stacked structure such that the sacrificial spacer exposes a sidewall of the third layer, and recessing the exposed sidewall of the third layer thereby forming a recess region between the second and fourth layers.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: October 29, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Yong Park, Eunsun Youm
  • METHODS OF FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
    Publication number: 20120171861
    Abstract: A method of fabricating a three-dimensional semiconductor device includes forming a stacked structure, and the stacked structure includes a first layer, a second layer, a third layer, and a fourth layer sequentially stacked on a substrate. The method also includes forming a sacrificial spacer on a sidewall of the stacked structure such that the sacrificial spacer exposes a sidewall of the third layer, and recessing the exposed sidewall of the third layer thereby forming a recess region between the second and fourth layers.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 5, 2012
    Inventors: Sang-Yong PARK, Eunsun Youm