Abstract: The present application relates to molded rice with toasted exterior and a method for preparing the same. The molded rice of the present application undergoes a baking to have the exterior that looks toasted and has a unique flavor. Moreover, the molded rice of the present application has a firm and crunchy exterior akin to toasted rice, while being moist inside. Additionally, the molded rice of the present application has an outer of fried rice containing ingredients to exhibit the ingredient texture and has very excellent molding stability by maintaining the shape of the molded rice even after molding and cooking.

Abstract: The present invention relates to a frozen cooked rice including a molded cooked rice and a moisture transfer preventing layer formed on at least a part of the surface of the molded cooked rice, in which after the frozen cooked rice is defrosted under conditions of normal temperature and normal pressure for 1 day, the difference between the moisture content of the surface of the frozen cooked rice and the moisture content of a deep part of the frozen cooked rice is 5 wt% or more based on the total weight of the frozen cooked rice, and a method for preparing a frozen cooked rice, the method including forming a moisture transfer preventing layer on at least a part of the surface of a molded cooked rice, hardening the at least a part of the surface of the molded cooked rice on which the moisture transfer preventing layer is formed, and freezing the hardened molded cooked rice.

Abstract: Provided is a semiconductor package including a redistribution structure including at least one redistribution insulating layer and at least one redistribution pattern, at least one semiconductor chip located on the redistribution structure, and a molding layer located on the redistribution structure and covering the at least one semiconductor chip. The redistribution pattern includes a redistribution via passing through the redistribution insulating layer and extending in a first direction perpendicular to a top surface of the redistribution structure, and a redistribution line extending in a second direction parallel to the top surface of the redistribution structure. Inner side walls of the redistribution via have a certain inclination, and a difference between a thickness of a central portion of the redistribution line and a thickness of an edge of the redistribution line ranges from 1% to 10% of the thickness of the central portion of the redistribution line.

Abstract: A frozen food product according to the present application comprises: a frozen food; a food container having formed therein an inner space for accommodating the frozen food and formed of an edible material; and a packaging material including a first packaging material surrounding the frozen food and disposed between the food container and the frozen food, and a second packaging material surrounding the food container, in order to prevent moisture from being transferred to the food container, wherein the packaging material generates heat by means of microwaves.