Patents by Inventor Eunchul JANG

Eunchul JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and electronic device for distributing packet flow
    Patent number: 12547402
    Abstract: An example method for distributing packet flow by an electronic device including a plurality of processor cores may include receiving a plurality of packet flows for validation; validating the plurality of packet flows by a processor core(s) of the plurality of processor cores based on a validation parameter(s); sequentially distributing the plurality of validated packet flows among the plurality of processor cores for processing based on a combination of a try-lock and a ticket-lock or a core parameter; and transmitting the plurality of distributed packet flows to an electronic entity by the processor core of the plurality of processor cores.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: February 10, 2026
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nayan Ostwal, Eunchul Jang, Srihari Das Sunkada Gopinath, Kusung Lim
  • METHOD AND ELECTRONIC DEVICE FOR DISTRIBUTING PACKET FLOW
    Publication number: 20240069916
    Abstract: An example method for distributing packet flow by an electronic device including a plurality of processor cores may include receiving a plurality of packet flows for validation; validating the plurality of packet flows by a processor core(s) of the plurality of processor cores based on a validation parameter(s); sequentially distributing the plurality of validated packet flows among the plurality of processor cores for processing based on a combination of a try-lock and a ticket-lock or a core parameter; and transmitting the plurality of distributed packet flows to an electronic entity by the processor core of the plurality of processor cores.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Nayan OSTWAL, Eunchul JANG, Srihari Das SUNKADA GOPINATH, Kusung LIM