Patents by Inventor Eun Dong Kim
Eun Dong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130848Abstract: Disclosed is an artificial implant comprising: a silicone shell; and a filler filling the interior of the shell, wherein at least a portion of the shell is a rupture-prevention part comprising two or more silicone layers and one or more reinforcing material layers interposed therebetween.Type: ApplicationFiled: February 11, 2022Publication date: April 25, 2024Applicant: OSSTEMIMPLANT CO., LTD.Inventors: Eun Jung SIM, Byung Hwi KIM, Min Kyoung KIM, Ju Dong SONG, II Seok JANG
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Publication number: 20240130849Abstract: Disclosed are an artificial implant and a method for manufacturing same, the artificial implant comprising: a silicone shell consisting of an upper portion, a lower portion, and a side portion; and a filler injected into the silicone shell, wherein the silicone shell includes at least one silicone layer and at least one reinforcing layer, the reinforcing layer being provided on at least a portion of the lower portion and the side portion of the silicone shell, or the silicone shell includes a layered structure having a step.Type: ApplicationFiled: February 11, 2022Publication date: April 25, 2024Applicant: OSSTEMIMPLANT CO., LTD.Inventors: Eun Jung SIM, Byung Hwi KIM, Min Kyoung KIM, Ju Dong SONG, ll Seok JANG
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Patent number: 11957141Abstract: An apparatus and method for manufacturing a grilled seaweed includes the apparatus comprising a grilling unit having a first housing with a first inlet opening and a first outlet opening which communicate with each other; a first conveyor for transferring a sheet of seaweed from the first inlet opening to the first outlet opening; a first heating source installed over the first conveyor to discharge a flame onto a top surface of the seaweed being transferred by the first conveyor; and a second heating source installed on both sides of a lower portion of the first conveyor to apply a flame onto a bottom surface of the seaweed being transferred by the first conveyor.Type: GrantFiled: July 18, 2017Date of Patent: April 16, 2024Assignees: CJ CHEILJEDANG CORPORATION, CJ SEAFOOD CORPORATIONInventors: Joo Dong Park, Chang Yong Lee, Eun Soo Kwak, Dae Ik Kang, Tae Hyeong Kim, Young Sub Choi
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Publication number: 20240092228Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.Type: ApplicationFiled: January 20, 2023Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.Inventors: Jung Sang YOU, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
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Patent number: 11928998Abstract: A display device includes a display panel including a first partial panel region and a second partial panel region, and a panel driver which drives the display panel. The panel driver determines a first driving frequency for the first partial panel region and a second driving frequency for the second partial panel region. In a case where the first driving frequency and the second driving frequency are different from each other, the panel driver sets a boundary portion including a boundary between the first partial panel region and the second partial panel region, and determines a third driving frequency for the boundary portion to be between the first driving frequency and the second driving frequency.Type: GrantFiled: February 13, 2023Date of Patent: March 12, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Sangan Kwon, Soon-Dong Kim, Taehoon Kim, Hui Nam, Eun Sil Yun, Changnoh Yoon
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Publication number: 20240067056Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.Type: ApplicationFiled: March 6, 2023Publication date: February 29, 2024Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
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Patent number: 10103117Abstract: Provided is a method of manufacturing a fan-out type wafer level package. The method includes forming a fiducial mark pattern on a frame, attaching a semiconductor die to the frame with respect to the fiducial mark pattern, encapsulating the semiconductor die with a passivation layer, for reconstituting the semiconductor die as a wafer level, and sequentially forming a metal seed layer, a redistribution layer, an under bump metal (UBM) seed layer, an UBM layer, and a solder ball on a bonding pad of the semiconductor die upward exposed by an opening region of the passivation layer to finish a fan-out type wafer level package.Type: GrantFiled: August 24, 2016Date of Patent: October 16, 2018Assignee: SFA Semicon Co., Ltd.Inventors: Hyun Hak Jung, Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi, Byeong Ho Jeong
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Patent number: 10050499Abstract: Provided is a method of manufacturing a voice coil, and more particularly, a method of manufacturing a voice coil in which a coil pattern is formed on a wafer level package. The method includes (a) forming a first coil pattern including a first area in which a first seed metal layer is exposed upward, a second area in which a first passivation layer for forming a via hole in the first area is formed, and a third area in which a first photoresist layer is formed in a portion of the first area and the second area on an upper surface of a wafer, (b) filling an inside of the via hole formed in the first coil pattern with a conductive material and forming first coil windings, and (c) removing the first photoresist layer formed in the third area.Type: GrantFiled: November 13, 2015Date of Patent: August 14, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jai Kyoung Choi, Eun Dong Kim, Hyun Hak Jung, Hyeong Min Kim, Jong Hwi Jung, Su Kyung Lim
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Patent number: 9935072Abstract: The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.Type: GrantFiled: October 11, 2016Date of Patent: April 3, 2018Assignee: SFA SEMICON CO., LTD.Inventors: Byeong Ho Jeong, Eun Dong Kim, Jong Won Lee, Hyun Hak Jung, Jai Kyoung Choi
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Patent number: 9905551Abstract: Provided is a method of manufacturing a wafer level package. The method includes forming a repassivation layer that encapsulates a plurality of semiconductor chips isolated from a wafer, forming a through encapsulation via (TEV) in the repassivation layer, forming a redistribution layer electrically connected to the TEV, and forming a bump ball on the redistribution layer.Type: GrantFiled: July 15, 2015Date of Patent: February 27, 2018Assignee: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.Inventors: Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi
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Patent number: 9905436Abstract: A method for manufacturing a wafer level fan-out package includes attaching a semiconductor chip on a partial area of an IO pattern formed on one surface of a wafer, forming a first passivation layer on surfaces of the semiconductor chip and the wafer, forming an RDL (redistribution layer) that is electrically conducted with the IO pattern and the semiconductor chip, in a partial area of a top surface of the first passivation layer, and forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the RDL.Type: GrantFiled: February 25, 2016Date of Patent: February 27, 2018Assignee: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.Inventors: You Jin Oh, Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi
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Publication number: 20170125369Abstract: The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.Type: ApplicationFiled: October 11, 2016Publication date: May 4, 2017Inventors: Byeong Ho JEONG, Eun Dong KIM, Jong Won LEE, Hyun Hak JUNG, Jai Kyoung CHOI
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Publication number: 20170092510Abstract: A method for manufacturing a wafer level fan-out package includes attaching a semiconductor chip on a partial area of an IO pattern formed on one surface of a wafer, forming a first passivation layer on surfaces of the semiconductor chip and the wafer, forming an RDL (redistribution layer) that is electrically conducted with the IO pattern and the semiconductor chip, in a partial area of a top surface of the first passivation layer, and forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the RDL.Type: ApplicationFiled: February 25, 2016Publication date: March 30, 2017Inventors: You Jin OH, Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI
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Publication number: 20170062368Abstract: Provided is a method of manufacturing a fan-out type wafer level package. The method includes forming a fiducial mark pattern on a frame, attaching a semiconductor die to the frame with respect to the fiducial mark pattern, encapsulating the semiconductor die with a passivation layer, for reconstituting the semiconductor die as a wafer level, and sequentially forming a metal seed layer, a redistribution layer, an under bump metal (UBM) seed layer, an UBM layer, and a solder ball on a bonding pad of the semiconductor die upward exposed by an opening region of the passivation layer to finish a fan-out type wafer level package.Type: ApplicationFiled: August 24, 2016Publication date: March 2, 2017Inventors: Hyun Hak JUNG, Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI, Byeong Ho JEONG
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Publication number: 20170047831Abstract: Provided is a method of manufacturing a voice coil, and more particularly, a method of manufacturing a voice coil in which a coil pattern is formed on a wafer level package. The method includes (a) forming a first coil pattern including a first area in which a first seed metal layer is exposed upward, a second area in which a first passivation layer for forming a via hole in the first area is formed, and a third area in which a first photoresist layer is formed in a portion of the first area and the second area on an upper surface of a wafer, (b) filling an inside of the via hole formed in the first coil pattern with a conductive material and forming first coil windings, and (c) removing the first photoresist layer formed in the third area.Type: ApplicationFiled: November 13, 2015Publication date: February 16, 2017Applicant: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.Inventors: Jai Kyoung CHOI, Eun Dong KIM, Hyun Hak JUNG, Hyeong Min KIM, Jong Hwi JUNG, Su Kyung LIM
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Publication number: 20160365195Abstract: Provided is a method for manufacturing a voice coil, and more particularly, to a voice coil manufacturing method for forming a coil pattern on a wafer level package. The method for manufacturing a voice coil includes forming a first passivation layer on an upper surface of a wafer, forming a first coil directly on the first passivation layer, forming a second passivation layer on the first passivation layer and on an upper surface of the first coil, forming a third passivation layer on an upper surface of the second passivation layer, forming a second coil directly on the third passivation layer, and forming an external connection terminal on a portion of the second coil.Type: ApplicationFiled: July 9, 2015Publication date: December 15, 2016Inventors: Jai Kyoung CHOI, Eun Dong KIM, Hyun Hak JUNG, Hyeong Min KIM, Su Kyung LIM
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Publication number: 20160365324Abstract: Provided is a method of manufacturing a wafer level package. The method includes forming a repassivation layer that encapsulates a plurality of semiconductor chips isolated from a wafer, forming a through encapsulation via (TEV) in the repassivation layer, forming a redistribution layer electrically connected to the TEV, and forming a bump ball on the redistribution layer.Type: ApplicationFiled: July 15, 2015Publication date: December 15, 2016Inventors: Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI
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Patent number: 9466586Abstract: Provided are a semiconductor package and a method for manufacturing a semiconductor package. The method for manufacturing a wafer-level fan-out package includes attaching semiconductor chips sawed to have a predetermined size to one surface of a wafer at predetermined intervals, forming a first passivation layer on surfaces of the semiconductor chips and the wafer, forming a redistribution layer electrically connected to the semiconductor chips on portions of an upper surface of the first passivation layer, forming a second passivation layer on the upper surface of the first passivation layer and surfaces of portions of the redistribution layer, forming external connection terminals on portions of the redistribution layer in which the second passivation layer has not been formed, and performing sawing along package boundary lines (sawing lines) and polishing the wafer to be removed such that lower surfaces of the semiconductor chips are exposed.Type: GrantFiled: July 8, 2015Date of Patent: October 11, 2016Assignee: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.Inventors: Jai Kyoung Choi, Eun Dong Kim, Hyun Hak Jung, Hyeong Min Kim, Su Kyung Lim
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Publication number: 20140301567Abstract: The present invention relates to a method of providing a compensation service for characteristics of a sound system using a smart device comprises: (1) receiving information of the sound system from the smart device; (2) retrieving the inputted sound characteristics of the sound system; and (3) transmitting a compensation signal according to the sound characteristics to the smart device. A user can be provided with a sound compensation service according to the sound characteristics of his/her sound system, i.e. a speaker, an earphone or a headphone, just by allowing a service providing server to receiving information about the sound system from the smart device, retrieving the sound characteristics, and then transmitting a compensation signal according to the sound characteristics to the smart device.Type: ApplicationFiled: September 20, 2012Publication date: October 9, 2014Inventor: Eun Dong Kim