Abstract: Disclosed are a display panel including a light emitting panel, and a color conversion panel facing the light emitting panel, wherein the color conversion panel being converts an emission spectrum of light emitted from the light emitting panel, wherein the color conversion panel may include a color conversion layer including a plurality of regions including a color conversion region, and bank defining each region of the color conversion layer, the color conversion region may include quantum dots, and a refractive index of the bank is lower than a refractive index of the quantum dots, and an electronic device including the same.

Abstract: A chip embedded substrate includes: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.

Abstract: An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.

Abstract: A semiconductor package includes a first substrate, a pattern layer disposed on the first substrate, a first chip member disposed on a surface of the first substrate, lead frames mounted on the first substrate surrounding the first chip member, and a first encapsulation layer disposed on the first substrate, encapsulating the first chip member and the lead frame, wherein upper end portions of the lead frame and the first encapsulation layer are removed, and lead frame columns are exposed through the first encapsulation layer.

Abstract: An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.

Abstract: There are provided a carrier substrate including: a first metal layer; a barrier layer formed on one surface of the first carrier metal layer; and a second metal layer formed on one surface of the barrier layer, and a method of manufacturing a printed circuit board using the same.

Abstract: Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: an insulating layer; a first circuit buried below the insulating layer and having a lower surface formed to be exposed from a lower surface of the insulating layer; a second circuit layer formed on the insulating layer; and a first solder resist layer formed below the insulating layer and the first circuit layer and formed to expose a portion of the first circuit layer.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer.

Abstract: In accordance with various embodiments, there is provided a method of fabricating a die mounting substrate, including the steps of preparing a mounting substrate including a pad and a die including a terminal, and printing a conductive paste bump on one of the pad or the terminal. The method further includes the step of connecting the pad and the terminal to each other using the conductive paste bump, thereby surface-mounting the die on the mounting substrate.

Abstract: Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate.

Abstract: A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.