Abstract: A polishing process apparatus includes a carrier configured to support an object, a platen provided below the carrier and configured to accommodate at least one eddy current sensor, the at least one eddy current sensor including a coil configured to output an eddy current, a power supply circuit configured to supply power to the coil and a voltage detection circuit connected to the coil and configured to detect raw voltage data, a polishing pad on an upper surface of the platen, and a controller configured to acquire first data by receiving the raw voltage data from the voltage detection circuit a plurality of times while a polishing process is performed on the object, acquire second data by sequentially applying a first filter and a second filter to the first data, the first filter being different from the second filter and measure a thickness of a target layer included in the object based on the second data.

Abstract: The present invention relates to a method for separating and collecting single aggregates from fumed silica, and a method for classifying a shape of the collected single aggregates, and more specifically, includes preparing a slurry in which fumed silica is dispersed in water; aerosolizing the slurry; and collecting single aggregates of the finned silica in the aerosol using the electric field.

Abstract: A method of preparing a polishing composition includes forming a dispersion solution containing ceria particles, and irradiating ultraviolet (UV) light onto the dispersion solution.

Abstract: The present invention relates to an abrasive and a planarization method using the same, and more particularly, includes fumed silica. A BET specific surface area of the fumed silica is 200 m2/g to 450 m2/g, a shape of aggregates dispersed in the abrasive has an elongated shape or a round shape, and a ratio of the round shape of the aggregates is 50% to 90%.

Abstract: The present invention relates to a method for separating and collecting single aggregates from fumed silica, and a method for classifying a shape of the collected single aggregates, and more specifically, includes preparing a slurry in which fumed silica is dispersed in water; aerosolizing the slurry; and collecting single aggregates of the finned silica in the aerosol using the electric field.

Abstract: A polishing pad conditioning simulation method and apparatus are provided. The polishing pad conditioning simulation method includes extracting first characteristic information including process parameters of the conditioning, extracting second characteristic information including structure information of a conditioner, and extracting third characteristic information including structure information of a polishing pad, inputting the first characteristic information, the second characteristic information, and the third characteristic information to an algorithm, calculating a profile of the polishing pad, and displaying data based on the calculated profile of the polishing pad.

Abstract: A method of preparing a polishing composition includes forming a dispersion solution containing ceria particles, and irradiating ultraviolet (UV) light onto the dispersion solution.