Abstract: Provided is a display device including a display panel, an optical sensor, a timing controller, a scan driver, a data driver, and an image controller. The timing controller controls an image refresh rate of the display panel based on a refresh rate control signal. Thus, the display device provides improved visibility.

Abstract: A battery cell includes an electrode assembly, a pair of electrode leads electrically connected to the electrode assembly, a battery case configured to accommodate the pair of electrode leads such that the pair of electrode leads protrude at least partially in a front and rear direction of the battery cell, the battery case having an accommodation space formed to accommodate the electrode assembly, and a taping unit configured to integrally cover both side surfaces and upper and lower surfaces of the battery case.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A battery module includes at least two cell assemblies, a module housing having an upper cover formed by a top portion and a first side portion extending downward from a first side edge of the top portion, a first gas passage formed between the first side portion of the upper cover and a first side of the at least two cell assemblies for circulation of gas generated from the at least two cell assemblies, and a flame retardant plate in the first gas passage and extending between the at least two cell assemblies and the module housing, wherein the first side portion of the upper cover is coupled to the flame retardant plate.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A variable displacement swash plate type compressor control method and a variable displacement swash plate type compressor controlled thereby may include a first determination step of determining whether liquid refrigerant exists within the variable displacement swash plate type compressor; a first operation step of applying power to the field coil assembly and of not applying current to the electronic control valve, when it is determined in the first determination step S1 that the liquid refrigerant exists; a second determination step of comparing an elapsed period of time of operating in the first operation step with a predetermined reference time; and a second operation step of maintaining the power applied in the first operation step to the field coil assembly and applying current to the electronic control valve when the elapsed period of time is greater than or equal to the reference time.

Abstract: Disclosed are a medical indicator measuring method and an ultrasound diagnostic device therefor. The medical indicator measuring method according to an embodiment includes the steps of: an ultrasound diagnostic device acquiring ultrasound image data, extracting characteristic points from the acquired ultrasound image data, generating figure information configured from the extracted characteristic points, determining an anatomical structure from the generated figure information, and measuring a medical indicator on the basis of the determined anatomical structure.

Abstract: A system for inspecting an exterior of a battery cell includes a tray on which battery cells are mounted in a plurality of rows, a first photographing part configured to horizontally move along the tray and photograph an upper surface of the battery cell while on the tray, at least one shuttle on which the battery cell is mounted, a transfer part configured to transfer the battery cells from the tray to the shuttle, a second photographing part configured to photograph a side surface and a lower surface of the battery cell while in the shuttle, and an inspection part configured to inspect a photographed image and determine whether the battery cell is defective. The second photographing part simultaneously photographs the side surface and the lower surface of the battery cell to simultaneously display the side and lower surfaces of the battery cell in one image.

Abstract: A multilayer electronic component includes a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween. The first internal electrode includes a first main portion and a first lead portion connecting the first main portion, and the second internal electrode includes a second main portion and a second lead portion connecting the second main portion, and the lead portion of the first internal electrode and a main portion of the second internal electrode are partially overlapped.

Abstract: A multilayer electronic component includes a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween. The first internal electrode includes a first main portion and a first lead portion connecting the first main portion, and the second internal electrode includes a second main portion and a second lead portion connecting the second main portion, and the lead portion of the first internal electrode and a main portion of the second internal electrode are partially overlapped.

Abstract: Semiconductor devices, CMOS image sensors, electronic apparatuses and methods of fabricating the same are provided, the semiconductor devices include a semiconductor substrate having stopper layers and interlayer insulating layers which are alternately stacked, wherein interfaces between the stopper layers and the interlayer insulating layers are formed in a horizontal direction. A first conductor and a second conductor each vertically extend through the interlayer insulating layers and the stopper layers. An insulating shielding wall is formed between the first and second conductors. The insulating shielding wall vertically extends through the interfaces between the stopper layers and the interlayer insulating layers such that at least one of the interfaces is divided into separate sections.

Abstract: A CMOS image sensor includes digital signal processing on-chip within the CMOS image sensor before being transmitted to an ISP (image signal processor) within an image sensor system. An on-chip digital processing unit is formed on a same one integrated circuit die with a pixel array and performs the steps of: performing a first set of at least one correction operation on the original digital signal to generate a corrected digital signal; formatting the corrected digital signal for the standard interface to generate a processed digital signal; and sending the processed digital signal to the ISP (image signal processor) via the standard interface.