Patents by Inventor Eungyul Lee

Eungyul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11353268
    Abstract: A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: June 7, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Jiwon Choi, Eungyul Lee, Hanchoon Lee
  • Patent number: 11041676
    Abstract: A heat exchanger may include flat tubes formed of a microchannel type, and first and second fins positioned at a top and bottom of the flat tubes so as to conduct the heat of the flat tubes. The first and second fins may be respectively provided with first and second condensate water discharge fins at a top and bottom. The second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may come into contact, and the second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may be disposed in a line with respect to a vertical direction, thereby having an advantage of quickly transferring condensate water formed at the top to the bottom.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: June 22, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Eungyul Lee, Seungmo Jung, Juhyok Kim, Taegyun Park
  • Publication number: 20210131749
    Abstract: A heat exchanger for a refrigerator, which is of a microchannel type, includes a first heat exchange unit including a plurality of flat tubes, which serves to exchange heat between refrigerant and are connected to an introduction pipe, a second heat exchange unit including a plurality of flat tubes, which serve to exchange heat between the refrigerant and air and are disposed outside the first heat exchange unit so as to be connected to a discharge tube, and a connecting pipe connecting the first heat exchange unit to the second heat exchange unit to supply the refrigerant to the second heat exchange unit, wherein the first heat exchange unit is disposed so as to exchange heat with air, and wherein a total cross-sectional area of the flat tubes of the first heat exchange unit is larger than that of the flat tubes of the second heat exchange unit.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 6, 2021
    Inventors: Taegyun PARK, Juhyok KIM, Eungyul LEE, Jiwon CHOI
  • Publication number: 20210033349
    Abstract: A plate type heat exchanger according to an embodiment of the present disclosure includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate, in which the end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge which protrudes outward from an edge of the socket hole of the base.
    Type: Application
    Filed: July 13, 2020
    Publication date: February 4, 2021
    Inventors: Jiwon Choi, Eungyul Lee, Hanchoon Lee
  • Publication number: 20210018277
    Abstract: The present disclosure relates to a plate-type heat exchanger and a method for manufacturing same. A plate-type heat exchanger according to an embodiment of the present disclosure comprises a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively, wherein the flange parts are formed in a stepped shape and can thus increase the area adhered to the first plate and the second plate.
    Type: Application
    Filed: March 27, 2019
    Publication date: January 21, 2021
    Inventors: Eungyul LEE, Juhyok KIM, Jiwon CHOI, Sanghoon YOO, Hanchoon LEE
  • Patent number: 10551127
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: February 4, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20180231319
    Abstract: The present invention relates to a heat exchanger comprising: flat tubes formed of a microchannel type; and first and second fins positioned at the top and bottom of the flat tubes so as to conduct the heat of the flat tubes, wherein the first and second fins are respectively provided with first and second condensate water discharge pins at the top and bottom, the second condensate water discharge pins of the first fins and the first condensate water discharge pins of the second fins come into contact, and the second condensate water discharge pins of the first fins and the first condensate water discharge pins of the second fins are disposed in a line with respect to the vertical direction, thereby having the advantage of quickly transferring condensate water formed at the top to the bottom.
    Type: Application
    Filed: July 29, 2016
    Publication date: August 16, 2018
    Inventors: Eungyul LEE, Seungmo JUNG, Juhyok KIM, Taegyun PARK
  • Publication number: 20170030662
    Abstract: A heat exchanger is provided which is capable of rapidly moving condensed water downward. The heat exchanger may include a plurality of flat tubes forming a plurality of flow paths therein; and a fin located between the plurality of flat tubes to conduct heat.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Inventors: Eungyul LEE, Seungmo JUNG, Juhyok KIM
  • Patent number: 9557121
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: January 31, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Patent number: 9353997
    Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: May 31, 2016
    Assignee: LG ELECTRONICS INC.
    Inventors: Sehyeon Kim, Eungyul Lee
  • Publication number: 20150226498
    Abstract: A heat exchanger is provided. The heat exchanger includes a refrigerant tube through which a refrigerant flows, the refrigerant tube being arranged in a plurality of rows, a first header on which a refrigerant inflow part is disposed, the first header being coupled to one side of the plurality of refrigerant tubes, a first partition part for partitioning an inner space of the first header, a second header on which a refrigerant discharge part is disposed, the second header being coupled to the other side of the plurality of refrigerant tubes, a second partition part for partitioning an inner space of the second header, and a baffle coupled to the first or second partition part, the baffle guiding a flow of the refrigerant from the header to the plurality of refrigerant tubes. The refrigerant discharge part of the second header is disposed lower than the refrigerant inflow part of the first header.
    Type: Application
    Filed: January 21, 2015
    Publication date: August 13, 2015
    Inventors: Taegyun Park, Sanghoon Yoo, Eungyul Lee
  • Patent number: 9033029
    Abstract: A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: May 19, 2015
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20150114030
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.
    Type: Application
    Filed: April 19, 2013
    Publication date: April 30, 2015
    Applicant: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Patent number: 8671706
    Abstract: A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: March 18, 2014
    Assignee: LG Electronics Inc.
    Inventors: Simwon Chin, Eungyul Lee, Younghwan Ko, Sangkyoung Park
  • Publication number: 20130292104
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 7, 2013
    Applicant: LG Electronics Inc.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20130284414
    Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 31, 2013
    Applicant: LG Electronics Inc.
    Inventors: Sehyeon Kim, Eungyul Lee
  • Publication number: 20130126140
    Abstract: A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.
    Type: Application
    Filed: January 26, 2012
    Publication date: May 23, 2013
    Inventors: Taegyun PARK, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20110113804
    Abstract: A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved.
    Type: Application
    Filed: July 29, 2010
    Publication date: May 19, 2011
    Inventors: Simwon Chin, Eungyul Lee, Younghwan Ko, Sangkyoung Park