Patents by Inventor Eunha OH

Eunha OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of depositing a thin layer
    Patent number: 11639550
    Abstract: An apparatus for depositing a thin layer and associated method, the apparatus including a process chamber; a support in the process chamber, substrates being supportable on the support at different heights; a gas injector configured to inject a gas into the process chamber; and a heater configured to heat the process chamber, wherein the gas injector includes a first injector configured to inject a first gas; and a second injector configured to inject a second gas, a flow rate of the first gas injected from the first injector ranges from 120 sccm to 240 sccm, and a flow rate of the second gas injected from the second injector ranges from 1,200 sccm to 2,400 sccm.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Gu Kim, Homin Son, Junghyeon Kim, Hangkyu Song, Eunha Oh, Oleg Feygenson, Donghyun Jang, Sung-Woo Jeon, Wooyeon Hwang
  • APPARATUS AND METHOD OF DEPOSITING A THIN LAYER
    Publication number: 20220333247
    Abstract: An apparatus for depositing a thin layer and associated method, the apparatus including a process chamber; a support in the process chamber, substrates being supportable on the support at different heights; a gas injector configured to inject a gas into the process chamber; and a heater configured to heat the process chamber, wherein the gas injector includes a first injector configured to inject a first gas; and a second injector configured to inject a second gas, a flow rate of the first gas injected from the first injector ranges from 120 sccm to 240 sccm, and a flow rate of the second gas injected from the second injector ranges from 1,200 sccm to 2,400 sccm.
    Type: Application
    Filed: October 14, 2021
    Publication date: October 20, 2022
    Inventors: Dong-Gu KIM, Homin SON, Junghyeon KIM, Hangkyu SONG, Eunha OH, Oleg FEYGENSON, Donghyun JANG, Sung-Woo JEON, Wooyeon HWANG