Abstract: Provided are a moisture detection sensor, a defect detection sensor, and a sensor array using the same that make use of moisture-sensitive compounds reversibly reacting to water (moisture) to emit fluorescence, thereby reversibly sensing the moisture within a short period of time and also providing a high degree of sensitivity even to an extremely small quantity of moisture. The moisture detection sensor includes one or more moisture-sensitive compounds selected from the group consisting of Calcein, Calcein-AM (Calcein acetoxymethyl ester), and Calcein blue.

Abstract: The present invention discloses a ceramic ink having an improved refill rate, which enables the manufacture of a ceramic thick film having delicate and improved ceramic properties. To this end, the ceramic ink of the present invention contains a certain amount of a solvent in which ceramic powder is dispersed, and the particles of the ceramic powder have on average a ratio of less than 20% in difference value between the maximum vertical length Dv and the maximum horizontal length Dh with respect to the maximum horizontal length Dh of the cross section of the particle. Also, in case of the presence of a plurality of interior angles at the circumference of the cross section, the maximal angle can be less than 135° among the interior angles.

Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.

Abstract: The present invention relates to a halogen-free flame-retardant resin composition and a prepreg and a copper clad laminate using the same. The present invention provides a halogen-free flame-retardant resin composition comprising a polyphosphate compound as phosphorus-based flame retardant and a prepreg and a copper clad laminate using the same. The resin composition of the present invention has superior flame retardancy without using a halogen-based flame retardant. Also, because it has superior heat resistance, a high glass transition temperature (Tg), good copper peeling strength and superior lead heat resistance after moisture absorption, it can be utilized in a copper clad laminate for printed circuit boards, etc.

Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.