Patents by Inventor Eun-hee Jung
Eun-hee Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145693Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery including the same, and more particularly, to a positive electrode active material including an overlithiated lithium manganese-based oxide, which is able to prevent the degradation of the electrochemical properties of a lithium secondary battery, including rate characteristics, caused by an excess of lithium and manganese in the lithium manganese-based oxide by inducing the growth of primary particles constituting the lithium manganese-based oxide, and prevent the lifetime deterioration of a lithium secondary battery by reducing side reactions between the lithium manganese-based oxide and a liquid electrolyte particularly during high-voltage operation, and at the same time, inhibiting or mitigating the release of a transition metal from the lithium manganese-based oxide, and a lithium secondary battery including the same.Type: ApplicationFiled: May 3, 2023Publication date: May 2, 2024Applicant: ECOPRO BM CO., LTD.Inventors: Ra Na LIM, Hyun Su JUNG, Kyung Min LIM, Eun Hee PARK, Seong Kyun KIM
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Publication number: 20240145677Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery including the same, and more particularly, to a bimodal-type positive electrode active material which is capable of improving the low energy density per unit volume of an overlithiated lithium manganese-based oxide, preventing the degradation of electrochemical properties of a lithium secondary battery, including rate characteristics, caused by an excess of lithium and manganese in the lithium manganese-based oxide, and particularly preventing the lifetime deterioration of a lithium secondary battery by inhibiting or mitigating the release of a transition metal from the lithium manganese-based oxide, and a lithium secondary battery including the same.Type: ApplicationFiled: May 25, 2023Publication date: May 2, 2024Applicant: ECOPRO BM CO., LTD.Inventors: Ra Na LIM, Hyun Su JUNG, Kyung Min LIM, Eun Hee PARK, Seong Kyun KIM
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Publication number: 20240141061Abstract: The present disclosure relates to an antibody binding specifically to CD55 or an antigen-binding fragment thereof; and a composition for preventing, treating and/or diagnosing cancer containing the same. The antibody of the present disclosure may be used as an effective therapeutic composition for various CD55-mediated diseases since it shows high binding ability and inhibitory effect for the CD55 protein which promotes tumor growth by inhibiting the complement immune mechanism. In addition, the antibody of the present disclosure may be usefully used as an effective therapeutic adjuvant that fundamentally removes drug resistance and remarkably improves therapeutic responsiveness in various diseases in which resistance to therapeutic agents with CDC (complement-dependent cytotoxicity) as a mechanism of action has been induced due to overexpression of CD55.Type: ApplicationFiled: January 12, 2022Publication date: May 2, 2024Applicants: SG MEDICAL INC, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, KOREA ATOMIC ENERGY RESEARCH INSTITUTEInventors: Ji Chul LEE, Hye In PARK, Sung-Won MIN, Sung-Won MIN, Hyeong Sun KWON, Jae Cheong LIM, So Hee DOH, Eun Ha CHO, So-Young LEE, Sung Hee JUNG
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Publication number: 20240145694Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery including the same, and more particularly, to a positive electrode active material including an overlithiated lithium manganese-based oxide, and capable of preventing the degradation of electrochemical properties of a lithium secondary battery, including rate characteristics, caused by an excess of lithium and manganese in the lithium manganese-based oxide and reducing side reactions between the lithium manganese-based oxide and a liquid electrolyte during high-voltage operation through induction of the growth of primary particles constituting the lithium manganese-based oxide.Type: ApplicationFiled: May 9, 2023Publication date: May 2, 2024Applicant: ECOPRO BM CO., LTD.Inventors: Ra Na LIM, Hyun Su JUNG, Kyung Min LIM, Eun Hee PARK, Seong Kyun KIM
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Publication number: 20240145695Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery including the same, and more particularly, to a bimodal-type positive electrode active material for improving the low energy density per unit volume of an overlithiated lithium manganese-based oxide and a lithium secondary battery including the same.Type: ApplicationFiled: May 25, 2023Publication date: May 2, 2024Applicant: ECOPRO BM CO., LTD.Inventors: Ra Na LIM, Hyun Su JUNG, Kyung Min LIM, Eun Hee PARK, Seong Kyun KIM
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Publication number: 20240130419Abstract: A flavoring sheet with improved physical properties, a smoking article including the same, and methods of producing the flavoring sheet and the smoking article are provided. The flavoring sheet according to some embodiments of the present disclosure may include a hydrocolloid material configured to form a sheet, a flavoring, and a plasticizer. The plasticizer can improve physical properties of the flavoring sheet and thus enhance workability of a process of cutting the flavoring sheet.Type: ApplicationFiled: July 10, 2022Publication date: April 25, 2024Applicant: KT&G CORPORATIONInventors: Geon Chang LEE, Ick Joong KIM, Kyung Bin JUNG, Eun Mi JEOUNG, Min Hee HWANG
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Publication number: 20240090321Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, an organic electroluminescent device having improved driving voltage, power efficiency and/or lifetime characteristics compared to conventional organic electroluminescent devices can be provided.Type: ApplicationFiled: July 17, 2023Publication date: March 14, 2024Inventors: So-Young JUNG, Hyun-Ju KANG, Sang-Hee CHO, Tae-Jun HAN, Hyo-Nim SHIN, Eun-Joung CHOI
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Patent number: 10546844Abstract: In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on a lower surface and/or an upper surface of an interposer substrate, the signal pad having a first height and the thermal diffusion member having a second height greater than the first height. The first package substrate, the interposer substrate, and the second package substrate are sequentially stacked on one another such that the thermal diffusion member is in contact with an upper surface of the first semiconductor chip or a lower surface of the second package substrate.Type: GrantFiled: November 3, 2016Date of Patent: January 28, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Choon Kim, Eon-Soo Jang, Eun-Hee Jung, Hyon-Chol Kim, Byeong-Yeon Cho
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Publication number: 20170154878Abstract: In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on a lower surface and/or an upper surface of an interposer substrate, the signal pad having a first height and the thermal diffusion member having a second height greater than the first height. The first package substrate, the interposer substrate, and the second package substrate are sequentially stacked on one another such that the thermal diffusion member is in contact with an upper surface of the first semiconductor chip or a lower surface of the second package substrate.Type: ApplicationFiled: November 3, 2016Publication date: June 1, 2017Inventors: Jae-Choon Kim, Eon-Soo Jang, Eun-Hee Jung, Hyon-Chol Kim, Byeong-Yeon Cho
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Publication number: 20150035148Abstract: A semiconductor package including a lower package including a lower package substrate and a lower semiconductor chip, the lower package substrate including an interconnection part and a core part, the core part including connection vias exposed by openings, the lower semiconductor chip buried in the core part, an upper package including an upper package substrate, an upper semiconductor chip provided on the upper package substrate, and solder balls provided on a bottom surface of the upper package substrate, and an intermetallic compound layer at an interface between the connection vias and the solder balls in the openings may be provided.Type: ApplicationFiled: May 30, 2014Publication date: February 5, 2015Inventors: Heeseok LEE, Yoonha JUNG, Jongkook KIM, Eun-Hee JUNG
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Patent number: 8850389Abstract: Disclosed are an apparatus and method for generating applications. A plurality of source codes corresponding to functional modules of the applications are stored in the module storage unit 120. The request analysis unit analyzes a request received from a client who has requested application generation and generates a module list needed to implement functions of the applications. The application generation unit combines the source codes corresponding to the generated module list to generate a first application to be executed in a service provision system of the client and a second application to be executed in a service use system corresponding to the service provision system of the client. According to the present invention, any franchise affiliate owner or general user without application development capability can produce two mutually linked applications easily by one-time input.Type: GrantFiled: October 28, 2011Date of Patent: September 30, 2014Assignee: Samsung SDS Co., Ltd.Inventors: Young-Min Jo, Kye-Su Song, Eun-Hee Jung
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Publication number: 20130093102Abstract: Semiconductor packages are provided. The semiconductor package includes a package substrate. A semiconductor chip structure is mounted on the package substrate and includes a plurality of semiconductor chips. A molding member covers the semiconductor chip structure and the package substrate. The plurality of semiconductor chips are vertically stacked and stepped toward one direction. A thickness of an uppermost semiconductor chip of the plurality of semiconductor chips is greater than an average thickness of the other semiconductor chips thereunder. Related methods are also provided.Type: ApplicationFiled: September 5, 2012Publication date: April 18, 2013Inventors: EUN-HEE JUNG, Hee Chul Lee
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Publication number: 20120199961Abstract: Semiconductor packages include a semiconductor chip, a lead frame on which the semiconductor chip is mounted, and a mold layer to encapsulate the semiconductor chip and the lead frame. The lead frame is electrically connected to the semiconductor chip. The lead frame includes a first lead frame and a second lead frame. The first lead frame is electrically connected to the semiconductor chip by a plurality of bonding wires. The first lead frame has outer leads that protrude from the mold layer. The second lead frame is attached to the first lead frame by an insulating adhesion layer. The second lead frame provides a mounting surface on which the semiconductor chip is mounted. The first and second lead frames support the semiconductor chip.Type: ApplicationFiled: February 7, 2012Publication date: August 9, 2012Applicant: Samsung Electronics Co., Ltd.Inventor: Eun-Hee JUNG
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Publication number: 20120110546Abstract: Disclosed are an apparatus and method for generating applications. A plurality of source codes corresponding to functional modules of the applications are stored in the module storage unit 120. The request analysis unit analyzes a request received from a client who has requested application generation and generates a module list needed to implement functions of the applications. The application generation unit combines the source codes corresponding to the generated module list to generate a first application to be executed in a service provision system of the client and a second application to be executed in a service use system corresponding to the service provision system of the client. According to the present invention, any franchise affiliate owner or general user without application development capability can produce two mutually linked applications easily by one-time input.Type: ApplicationFiled: October 28, 2011Publication date: May 3, 2012Applicant: SAMSUNG SDS CO., LTD.Inventors: Young-Min JO, Kye-Su SONG, Eun-Hee JUNG
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Publication number: 20070256444Abstract: A water supplying apparatus which includes a cold water pipe supplying a cold water, a hot water pipe supplying a hot water, and a dispenser connected with the cold water pipe and the hot water pipe. The dispenser includes a housing comprising a cold water inlet through which cold water supplied from the cold water pipe flows in, a hot water inlet through which hot water supplied from the hot water pipe flows in, and a single outlet through which the hot water or the cold water flows out, an inlet regulating part reciprocating in the housing to selectively open the cold water inlet and the hot water inlet, and an outlet regulating part opening and closing the outlet. Thus, the present invention provides a water supplying apparatus and a refrigerator having the same selectively supplying a hot water and a cold water by using a single lever.Type: ApplicationFiled: March 12, 2007Publication date: November 8, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seon-ho Kim, Jin-oh Seok, Seok-jun Son, Eun-hee Jung
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Publication number: 20070251261Abstract: A hot water supplying refrigerator which includes a main body having a storage compartment, a door opening and closing the storage compartment, and a dispenser provided to the door. The refrigerator includes a hot water tank storing water supplied from an outside, a heater heating water stored in the hot water tank, a hot water pipe connecting the hot water tank and the dispenser, a circulating part circulating water remained in the hot water pipe to the hot water tank, and a control part controlling the heater. Thus, the present invention provides a hot water supplying refrigerator and a control method thereof supplying hot water with a constant temperature, and preventing water remained in a hot water pipe from being wasted.Type: ApplicationFiled: March 8, 2007Publication date: November 1, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seok-jun Son, Seong-ki Jeong, Jin-oh Seok, Seon-ho Kim, Eun-hee Jung