Abstract: In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on a lower surface and/or an upper surface of an interposer substrate, the signal pad having a first height and the thermal diffusion member having a second height greater than the first height. The first package substrate, the interposer substrate, and the second package substrate are sequentially stacked on one another such that the thermal diffusion member is in contact with an upper surface of the first semiconductor chip or a lower surface of the second package substrate.

Abstract: In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on a lower surface and/or an upper surface of an interposer substrate, the signal pad having a first height and the thermal diffusion member having a second height greater than the first height. The first package substrate, the interposer substrate, and the second package substrate are sequentially stacked on one another such that the thermal diffusion member is in contact with an upper surface of the first semiconductor chip or a lower surface of the second package substrate.

Abstract: A semiconductor package including a lower package including a lower package substrate and a lower semiconductor chip, the lower package substrate including an interconnection part and a core part, the core part including connection vias exposed by openings, the lower semiconductor chip buried in the core part, an upper package including an upper package substrate, an upper semiconductor chip provided on the upper package substrate, and solder balls provided on a bottom surface of the upper package substrate, and an intermetallic compound layer at an interface between the connection vias and the solder balls in the openings may be provided.

Abstract: Disclosed are an apparatus and method for generating applications. A plurality of source codes corresponding to functional modules of the applications are stored in the module storage unit 120. The request analysis unit analyzes a request received from a client who has requested application generation and generates a module list needed to implement functions of the applications. The application generation unit combines the source codes corresponding to the generated module list to generate a first application to be executed in a service provision system of the client and a second application to be executed in a service use system corresponding to the service provision system of the client. According to the present invention, any franchise affiliate owner or general user without application development capability can produce two mutually linked applications easily by one-time input.

Abstract: Semiconductor packages are provided. The semiconductor package includes a package substrate. A semiconductor chip structure is mounted on the package substrate and includes a plurality of semiconductor chips. A molding member covers the semiconductor chip structure and the package substrate. The plurality of semiconductor chips are vertically stacked and stepped toward one direction. A thickness of an uppermost semiconductor chip of the plurality of semiconductor chips is greater than an average thickness of the other semiconductor chips thereunder. Related methods are also provided.

Abstract: Semiconductor packages include a semiconductor chip, a lead frame on which the semiconductor chip is mounted, and a mold layer to encapsulate the semiconductor chip and the lead frame. The lead frame is electrically connected to the semiconductor chip. The lead frame includes a first lead frame and a second lead frame. The first lead frame is electrically connected to the semiconductor chip by a plurality of bonding wires. The first lead frame has outer leads that protrude from the mold layer. The second lead frame is attached to the first lead frame by an insulating adhesion layer. The second lead frame provides a mounting surface on which the semiconductor chip is mounted. The first and second lead frames support the semiconductor chip.

Abstract: Disclosed are an apparatus and method for generating applications. A plurality of source codes corresponding to functional modules of the applications are stored in the module storage unit 120. The request analysis unit analyzes a request received from a client who has requested application generation and generates a module list needed to implement functions of the applications. The application generation unit combines the source codes corresponding to the generated module list to generate a first application to be executed in a service provision system of the client and a second application to be executed in a service use system corresponding to the service provision system of the client. According to the present invention, any franchise affiliate owner or general user without application development capability can produce two mutually linked applications easily by one-time input.

Abstract: A water supplying apparatus which includes a cold water pipe supplying a cold water, a hot water pipe supplying a hot water, and a dispenser connected with the cold water pipe and the hot water pipe. The dispenser includes a housing comprising a cold water inlet through which cold water supplied from the cold water pipe flows in, a hot water inlet through which hot water supplied from the hot water pipe flows in, and a single outlet through which the hot water or the cold water flows out, an inlet regulating part reciprocating in the housing to selectively open the cold water inlet and the hot water inlet, and an outlet regulating part opening and closing the outlet. Thus, the present invention provides a water supplying apparatus and a refrigerator having the same selectively supplying a hot water and a cold water by using a single lever.

Abstract: A hot water supplying refrigerator which includes a main body having a storage compartment, a door opening and closing the storage compartment, and a dispenser provided to the door. The refrigerator includes a hot water tank storing water supplied from an outside, a heater heating water stored in the hot water tank, a hot water pipe connecting the hot water tank and the dispenser, a circulating part circulating water remained in the hot water pipe to the hot water tank, and a control part controlling the heater. Thus, the present invention provides a hot water supplying refrigerator and a control method thereof supplying hot water with a constant temperature, and preventing water remained in a hot water pipe from being wasted.